Effects on the thermal properties of nanoclay addition at different ratios to hybrid composite

IF 1.3 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY Emerging Materials Research Pub Date : 2022-09-01 DOI:10.1680/jemmr.22.00045
İ. Öner, G. Öner
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引用次数: 1

Abstract

In recent years, observing the advances in nano-technology, many attempts have been made in using nano-particles in nanoclay resin to improve thermal conductivity, and some success has already been achieved. In this study, the thermal properties and experimental results of a composite wall made of Glass / Carbon / Glass layers with nanoclay epoxy resin in between thereof in different ratios (0.5%, 0.75% and 1.25% by volume) were obtained and with plain sample compared. For this purpose, TG, DSC analyzes and heat conduction tests of prepared samples were performed. Experimental results show that its thermal conductivity is increased by about 7.88 % with the 0.75% wt addition of nanoclay. In addition, TG analysis results showed that the lowest mass loss was observed in the samples with 0.75% nanoclay with a value of approximately 18.32%. In the DSC results, the highest glass transition temperature of 433 °C and the highest crystallization temperature of 553 °C were observed in the 1.25% nanoclay added samples.
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不同配比纳米粘土对杂化复合材料热性能的影响
近年来,随着纳米技术的进步,人们在纳米粘土树脂中使用纳米颗粒来提高导热性方面进行了许多尝试,并取得了一些成功。在本研究中,获得了由玻璃/碳/玻璃层和纳米粘土环氧树脂以不同比例(0.5%、0.75%和1.25%体积)制成的复合壁的热性能和实验结果,并与普通样品进行了比较。为此,对制备的样品进行了TG、DSC分析和热传导测试。实验结果表明,添加0.75%wt的纳米粘土使其导热系数提高了7.88%。此外,TG分析结果显示,在添加0.75%纳米粘土的样品中观察到最低的质量损失,其值约为18.32%。在DSC结果中,在添加1.25%纳米粘土样品中观测到最高玻璃化转变温度为433°C和最高结晶温度为553°C。
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来源期刊
Emerging Materials Research
Emerging Materials Research MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
4.50
自引率
9.10%
发文量
62
期刊介绍: Materials Research is constantly evolving and correlations between process, structure, properties and performance which are application specific require expert understanding at the macro-, micro- and nano-scale. The ability to intelligently manipulate material properties and tailor them for desired applications is of constant interest and challenge within universities, national labs and industry.
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