Bulk side-based polyimide based on polyhedral oligomeric silsesquioxane cross-linking: Towards lower dielectric constant and better mechanical property

IF 1.8 4区化学 Q3 POLYMER SCIENCE High Performance Polymers Pub Date : 2023-08-31 DOI:10.1177/09540083231198882

Mengqiu Wang, Qianyu Song, Lishuai Zheng, Linxi Hou

引用次数: 0

Abstract

The synthesis of a low dielectric constant polyimide (PI) with a polyhedral oligomeric silsesquioxane (POSS) cross-linked structure is presented. A non-planar conjugated diamine monomer (FSNH2) with two -CH=CH2 reactive groups was first synthesised in a two-step process, and then two polyimides were synthesized by PSS-Octavinyl (OVPOSS) substituted, FSNH2 and dianhydride. OVPOSS cross-linked polyimides have good thermal stability and low dielectric constant. 6FDA-FSNH2-OVPOSS(6FPI-3) can reach a minimum dielectric constant of 2.08 (108 Hz) and a dielectric loss of 0.008 (108 Hz). In addition, the cross-linked structure of the OVPOSS and polyimide chains prevents the agglomeration of OVPOSS to a certain extent and improves the tensile strength and elongation at break of the polyimides, which has great application potential in large-scale integrated circuits.

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基于多面体低聚倍半硅氧烷交联的体侧基聚酰亚胺：降低介电常数和改善机械性能

介绍了一种具有多面体低聚倍半硅氧烷（POSS）交联结构的低介电常数聚酰亚胺（PI）的合成。首先采用两步法合成了具有两个-CH=CH2反应基团的非平面共轭二胺单体（FSNH2），然后用PSS八乙烯基（OVPOSS）取代、FSNH2和二酐合成了两种聚酰亚胺。OVPOSS交联聚酰亚胺具有良好的热稳定性和低介电常数。6FDA-FSNH2-OVPOSS（6FPI-3）可以达到2.08（108Hz）的最小介电常数和0.008（108赫兹）的介电损耗。此外，OVPOSS和聚酰亚胺链的交联结构在一定程度上防止了OVPOSS的团聚，提高了聚酰亚胺的拉伸强度和断裂伸长率，在大规模集成电路中具有巨大的应用潜力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

High Performance Polymers 化学-高分子科学

CiteScore

4.20

自引率

14.30%

发文量

106

审稿时长

1.2 months

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