Inês S. Garcia , José Fernandes , José B. Queiroz , Carlos Calaza , José Moreira , Rosana A. Dias , Filipe S. Alves
{"title":"Microfabrication of double proof-mass SOI-based matryoshka-like structures for 3-axis MEMS accelerometers","authors":"Inês S. Garcia , José Fernandes , José B. Queiroz , Carlos Calaza , José Moreira , Rosana A. Dias , Filipe S. Alves","doi":"10.1016/j.mne.2023.100204","DOIUrl":null,"url":null,"abstract":"<div><p>This work presents a micromachining process that allows the creation of hierarchical, matryoshka-like MEMS structures that can be used for multi-axis sensing. This novel vibration multi-axis MEMS sensor based on the capacitive open-loop operation can be widely deployed in the structural monitoring systems due to its simple fabrication and operating principle. The device is composed by a double proof-mass hierarchical design with separate sets of electrodes for in-plane differential measurements. The operation principle of this multi-axis device relies on the fact that accelerations in the zz direction will induce a change in the overlapping area of the xx and yy sensing electrodes, extracted from the single-ended capacitance measurement, while xx and yy accelerations will yield a differential capacitance change. To sense the direction of zz accelerations (capacitance decrease independently of the direction), out-of-plane parallel-plates were added to the device using suspended metallic membranes. The devices were fabricated through an in-house process using a seven-mask dicing-free MEMS process on a 10 μm-thick SOI wafer. The proposed devices were successfully validated using a two-degrees of freedom (DoF) setup that induces external accelerations in the three-orthogonal axes and reads the resulting output voltage of the device. It then possible to conclude that using the proposed fabrication process, it is possible to successfully produce functional multi-structure SOI-based devices that integrate suspended metallic membranes.</p></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"19 ","pages":"Article 100204"},"PeriodicalIF":2.8000,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micro and Nano Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2590007223000345","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This work presents a micromachining process that allows the creation of hierarchical, matryoshka-like MEMS structures that can be used for multi-axis sensing. This novel vibration multi-axis MEMS sensor based on the capacitive open-loop operation can be widely deployed in the structural monitoring systems due to its simple fabrication and operating principle. The device is composed by a double proof-mass hierarchical design with separate sets of electrodes for in-plane differential measurements. The operation principle of this multi-axis device relies on the fact that accelerations in the zz direction will induce a change in the overlapping area of the xx and yy sensing electrodes, extracted from the single-ended capacitance measurement, while xx and yy accelerations will yield a differential capacitance change. To sense the direction of zz accelerations (capacitance decrease independently of the direction), out-of-plane parallel-plates were added to the device using suspended metallic membranes. The devices were fabricated through an in-house process using a seven-mask dicing-free MEMS process on a 10 μm-thick SOI wafer. The proposed devices were successfully validated using a two-degrees of freedom (DoF) setup that induces external accelerations in the three-orthogonal axes and reads the resulting output voltage of the device. It then possible to conclude that using the proposed fabrication process, it is possible to successfully produce functional multi-structure SOI-based devices that integrate suspended metallic membranes.