Site-to-Site Variation in Analog Multisite Testing: A Survey on Its Detection and Correction

IF 1.9 4区 工程技术 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE IEEE Design & Test Pub Date : 2023-10-01 DOI:10.1109/MDAT.2023.3261799
Praise O. Farayola, Ekaniyere Oko-Odion, Shravan K. Chaganti, Abalhassan Sheikh, S. Ravi, Degang Chen
{"title":"Site-to-Site Variation in Analog Multisite Testing: A Survey on Its Detection and Correction","authors":"Praise O. Farayola, Ekaniyere Oko-Odion, Shravan K. Chaganti, Abalhassan Sheikh, S. Ravi, Degang Chen","doi":"10.1109/MDAT.2023.3261799","DOIUrl":null,"url":null,"abstract":"Multisite testing, where multiple ICs are tested in parallel sharing the same automatic test equipment, is a widely used method today in IC high-volume test facilities. This article provides a survey of best practices to deal with the problem of site-to-site variation, specifically in the case of analog and mixed-signal ICs.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Design & Test","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1109/MDAT.2023.3261799","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"COMPUTER SCIENCE, HARDWARE & ARCHITECTURE","Score":null,"Total":0}
引用次数: 0

Abstract

Multisite testing, where multiple ICs are tested in parallel sharing the same automatic test equipment, is a widely used method today in IC high-volume test facilities. This article provides a survey of best practices to deal with the problem of site-to-site variation, specifically in the case of analog and mixed-signal ICs.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
模拟多站点测试中的站点间变化:检测和校正综述
多站点测试是目前IC大容量测试设施中广泛使用的一种方法,其中多个IC共享同一自动测试设备进行并行测试。本文提供了一份关于处理站点间变化问题的最佳实践的调查,特别是在模拟和混合信号IC的情况下。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
IEEE Design & Test
IEEE Design & Test COMPUTER SCIENCE, HARDWARE & ARCHITECTURE-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
3.80
自引率
5.00%
发文量
98
期刊介绍: IEEE Design & Test offers original works describing the models, methods, and tools used to design and test microelectronic systems from devices and circuits to complete systems-on-chip and embedded software. The magazine focuses on current and near-future practice, and includes tutorials, how-to articles, and real-world case studies. The magazine seeks to bring to its readers not only important technology advances but also technology leaders, their perspectives through its columns, interviews, and roundtable discussions. Topics include semiconductor IC design, semiconductor intellectual property blocks, design, verification and test technology, design for manufacturing and yield, embedded software and systems, low-power and energy-efficient design, electronic design automation tools, practical technology, and standards.
期刊最新文献
Postquantum Cryptography for Internet of Things STAR: A Mixed Analog Stochastic In-DRAM Convolutional Neural Network Accelerator Enabling Security of Heterogeneous Integration: From Supply Chain to In-Field Operations Flexible and Scalable BLAKE/BLAKE2 Coprocessor for Blockchain-Based IoT Applications Active and Passive Physical Attacks on Neural Network Accelerators
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1