Small ozone generator fabricated from low-temperature co-fired ceramics

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2021-01-13 DOI:10.1108/MI-07-2020-0043
K. Makarovič, D. Belavic, B. Malič, A. Benčan, F. Kovač, J. Holc
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Abstract

The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented.,The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter scales was realized.,The developed ozone generator with the dimensions of 63.6 × 41.8 × 1.3 mm produces approximately 1 vol. % of ozone in oxygen flow of 15 ml/min, at an applied voltage of 7 kV.,A miniature ozone generator, manufactured in LTCC technology, produces high amount of ozone and more than it is described in the available references or in datasheets of commercial devices of similar size.
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低温共烧陶瓷制备小型臭氧发生器
本文介绍了一种基于放电原理的微型臭氧发生器的设计、制造和性能评价。该器件采用低温共烧陶瓷(LTCC)技术,实现了微、毫米尺度上具有集成电极、埋置通道和空腔的多层陶瓷结构。研制的臭氧发生器尺寸为63.6 × 41.8 × 1.3 mm,体积约为1 vol。在7千伏电压下,在15毫升/分钟的氧气流量中臭氧的百分比。采用LTCC技术制造的微型臭氧发生器产生的臭氧量高,比现有参考文献或类似尺寸的商业设备的数据表中所描述的臭氧量多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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