Shogo Washida, Masayuki Imanishi, Ricksen Tandryo, Kazuma Hamada, K. Murakami, S. Usami, M. Maruyama, M. Yoshimura, Yusuke Mori
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引用次数: 0
Abstract
In recent years, we have achieved low threading dislocation density in GaN wafers by using the Na-flux multi-point seed technique. However, the resulting wafers exhibit regions of high dislocation density, exceeding 105 cm-2 at the coalescence boundary where pyramidal crystals merge. In this study, we discovered that annealing seed crystals at 900°C generated an uneven surface with approximately 50 µm of GaN decomposition, and growing GaN on the thus-generated uneven surfaces induced lateral growth composed of facets. We then investigated the effect of the uneven surface on dislocation reduction and found that the average threading dislocation density of the grown crystal was reduced from 9.7×105 cm-2 in the seed crystal to 1.2×105 cm-2. We confirmed that the reduction in threading dislocation density was due to the termination of dislocations by means of inclusions, and to mergers or annihilation as they encountered one another during facet growth.
期刊介绍:
The Japanese Journal of Applied Physics (JJAP) is an international journal for the advancement and dissemination of knowledge in all fields of applied physics. JJAP is a sister journal of the Applied Physics Express (APEX) and is published by IOP Publishing Ltd on behalf of the Japan Society of Applied Physics (JSAP).
JJAP publishes articles that significantly contribute to the advancements in the applications of physical principles as well as in the understanding of physics in view of particular applications in mind. Subjects covered by JJAP include the following fields:
• Semiconductors, dielectrics, and organic materials
• Photonics, quantum electronics, optics, and spectroscopy
• Spintronics, superconductivity, and strongly correlated materials
• Device physics including quantum information processing
• Physics-based circuits and systems
• Nanoscale science and technology
• Crystal growth, surfaces, interfaces, thin films, and bulk materials
• Plasmas, applied atomic and molecular physics, and applied nuclear physics
• Device processing, fabrication and measurement technologies, and instrumentation
• Cross-disciplinary areas such as bioelectronics/photonics, biosensing, environmental/energy technologies, and MEMS