Magnetotransport measurements as a tool for searching 3D topological insulators

IF 1 4区 工程技术 Q4 INSTRUMENTS & INSTRUMENTATION Metrology and Measurement Systems Pub Date : 2023-07-20 DOI:10.24425/mms.2021.137708
P. Śliż, I. Sankowska, E. Bobko, E. Szeregij, J. Grendysa, G. Tomaka, D. Żak, D. Ploch, A. Jasik
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Abstract

The paper covers some measurement aspects of transport of electrons through metals and semiconductors in magnetic field – magnetotransport – allowing for the determination of electrical parameters characteristic of three-dimensional (3D) topological insulators (TI) (i.e. those that behave like an insulator inside their volume and have a conductive layer on their surface). A characteristic feature of the 3D TI is also a lack of differences between the chemical composition of the conductive surface and the interior of the material tested and the fact that the electron states for its surface conductivity are topologically protected. In particular, the methods of generating strong magnetic fields, obtaining low temperatures, creating electrical contacts with appropriate geometry were presented, and the measurement methods were reviewed. In addition, the results of magnetotransport measurements obtained for two volumetric samples based on the HgCdTe compound grown with the molecular beam epitaxy method are presented.
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磁输运测量作为搜索三维拓扑绝缘体的工具
本文涵盖了电子在磁场中通过金属和半导体的输运的一些测量方面-磁输运-允许确定三维(3D)拓扑绝缘体(TI)的电气参数特征(即那些在其体积内表现得像绝缘体并在其表面上具有导电层的绝缘体)。3D TI的一个特征是导电表面和被测材料内部的化学成分之间没有差异,而且其表面导电性的电子状态受到拓扑保护。重点介绍了产生强磁场、获得低温、产生具有适当几何形状的电触点的方法,并对测量方法进行了综述。此外,还介绍了用分子束外延法生长的HgCdTe化合物的两个体积样品的磁输运测量结果。
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来源期刊
Metrology and Measurement Systems
Metrology and Measurement Systems INSTRUMENTS & INSTRUMENTATION-
CiteScore
2.00
自引率
10.00%
发文量
0
审稿时长
6 months
期刊介绍: Contributions are invited on all aspects of the research, development and applications of the measurement science and technology. The list of topics covered includes: theory and general principles of measurement; measurement of physical, chemical and biological quantities; medical measurements; sensors and transducers; measurement data acquisition; measurement signal transmission; processing and data analysis; measurement systems and embedded systems; design, manufacture and evaluation of instruments. The average publication cycle is 6 months.
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