{"title":"TGV通孔双面电镀铜填充模式调控及工艺可靠性试验研究","authors":"Shenglin Ma","doi":"10.1360/ssc-2023-0141","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":21640,"journal":{"name":"中国科学(化学)","volume":" ","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"中国科学(化学)","FirstCategoryId":"1089","ListUrlMain":"https://doi.org/10.1360/ssc-2023-0141","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Chemistry","Score":null,"Total":0}
引用次数: 0
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
