M. Kalaswad, J. Custer, S. Addamane, R. M. Khan, L. Jauregui, T. Babuska, A. Henriksen, F. DelRio, R. Dingreville, B. Boyce, D. Adams
{"title":"Sputter-Deposited Mo Thin Films: Multimodal Characterization of Structure, Surface Morphology, Density, Residual Stress, Electrical Resistivity, and Mechanical Response","authors":"M. Kalaswad, J. Custer, S. Addamane, R. M. Khan, L. Jauregui, T. Babuska, A. Henriksen, F. DelRio, R. Dingreville, B. Boyce, D. Adams","doi":"10.1007/s40192-023-00297-4","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":13604,"journal":{"name":"Integrating Materials and Manufacturing Innovation","volume":"12 1","pages":"118 - 129"},"PeriodicalIF":2.5000,"publicationDate":"2023-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Integrating Materials and Manufacturing Innovation","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1007/s40192-023-00297-4","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
期刊介绍：
The journal will publish: Research that supports building a model-based definition of materials and processes that is compatible with model-based engineering design processes and multidisciplinary design optimization; Descriptions of novel experimental or computational tools or data analysis techniques, and their application, that are to be used for ICME; Best practices in verification and validation of computational tools, sensitivity analysis, uncertainty quantification, and data management, as well as standards and protocols for software integration and exchange of data; In-depth descriptions of data, databases, and database tools; Detailed case studies on efforts, and their impact, that integrate experiment and computation to solve an enduring engineering problem in materials and manufacturing.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
