Modeling 2D Material-Based Nanoelectronic Devices in the Presence of Defects

IF 2.3 Q3 NANOSCIENCE & NANOTECHNOLOGY IEEE Nanotechnology Magazine Pub Date : 2023-08-01 DOI:10.1109/MNANO.2023.3278969
T. Knobloch, Dominic Waldhoer, T. Grasser
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Abstract

Two-dimensional materials promise excellent gate control and high drive currents at the ultimate scaling limit. However, numerous challenges must be overcome before silicon can potentially be replaced as the predominant channel material. For example, defects in two-dimensional materials and their vicinity pose a considerable challenge, as they have a sizable impact on the performance of such ultra-scaled devices.For enabling the transition from single lab-based devices to highly-integrated structures at an industrial scale, predictive modeling tools are required for devices based on two-dimensional semiconductors. Moreover, models for transport in nanoelectronic devices need to be efficiently coupled to physical defect models. This article presents multi-scale models for transport and defect simulations, linking them wherever possible. Based on the latest insights, important research questions for future studies are identified.
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存在缺陷的二维材料基纳米电子器件建模
二维材料保证了在最终缩放极限下的出色栅极控制和高驱动电流。然而,在硅可能被替换为主要的沟道材料之前,必须克服许多挑战。例如,二维材料及其附近的缺陷构成了相当大的挑战,因为它们对这种超规模器件的性能有相当大的影响。为了能够在工业规模上从基于单个实验室的设备过渡到高度集成的结构,基于二维半导体的设备需要预测建模工具。此外,纳米电子器件中的传输模型需要有效地耦合到物理缺陷模型。本文介绍了用于运输和缺陷模拟的多尺度模型,并尽可能将它们联系起来。基于最新的见解,确定了未来研究的重要研究问题。
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来源期刊
IEEE Nanotechnology Magazine
IEEE Nanotechnology Magazine NANOSCIENCE & NANOTECHNOLOGY-
CiteScore
2.90
自引率
6.20%
发文量
46
期刊介绍: IEEE Nanotechnology Magazine publishes peer-reviewed articles that present emerging trends and practices in industrial electronics product research and development, key insights, and tutorial surveys in the field of interest to the member societies of the IEEE Nanotechnology Council. IEEE Nanotechnology Magazine will be limited to the scope of the Nanotechnology Council, which supports the theory, design, and development of nanotechnology and its scientific, engineering, and industrial applications.
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