Multicultural Diversity Workforce and Global Technology Collaboration Empowered Semiconductor Manufacturing Excellence in Taiwan: A Manufacturing Engineer’s Perspective

IF 2.4 3区 工程技术 Q3 ENGINEERING, MANUFACTURING Journal of Manufacturing Science and Engineering-transactions of The Asme Pub Date : 2023-06-30 DOI:10.1115/1.4062729
A. Shih
{"title":"Multicultural Diversity Workforce and Global Technology Collaboration Empowered Semiconductor Manufacturing Excellence in Taiwan: A Manufacturing Engineer’s Perspective","authors":"A. Shih","doi":"10.1115/1.4062729","DOIUrl":null,"url":null,"abstract":"\n This paper summarizes the perspectives from a manufacturing engineer on how the government policy, global partnership, and diversity of the United States (US), Japanese, European, and traditional Chinese cultures in Taiwan have created a workforce of semiconductor manufacturing talent in the past five decades. The complex interwoven events of Covid-19 pandemic, supply chain resilience, national security, and geopolitical conflicts have made semiconductor manufacturing a key focus of government policy. As a world leader in integrated circuit (IC) design, design software, equipment, and research, the US has struggled in the past few years on the high yield volume manufacturing of the most advanced logic IC and failed to translate research innovations to quality production. Manufacturing, not innovation or equipment, is a key barrier of the US semiconductor industry. Two models for excellence in advanced manufacturing are described. Three pillars of government policy, global collaboration, and multicultural diversity empower semiconductor manufacturing excellence in Taiwan is described. An approach to evaluate, select, educate, and train manufacturing talents is proposed. Directions for semiconductor manufacturing research are discussed. There is no genius in semiconductor manufacturing, which requires extensive experience and continuous improvement without shortcuts to be competitive. The steadfast good government policy, multicultural diversity workforce, and global technology collaboration to achieve semiconductor manufacturing excellence are the focus of the conclusion.","PeriodicalId":16299,"journal":{"name":"Journal of Manufacturing Science and Engineering-transactions of The Asme","volume":" ","pages":""},"PeriodicalIF":2.4000,"publicationDate":"2023-06-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Manufacturing Science and Engineering-transactions of The Asme","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1115/1.4062729","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
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Abstract

This paper summarizes the perspectives from a manufacturing engineer on how the government policy, global partnership, and diversity of the United States (US), Japanese, European, and traditional Chinese cultures in Taiwan have created a workforce of semiconductor manufacturing talent in the past five decades. The complex interwoven events of Covid-19 pandemic, supply chain resilience, national security, and geopolitical conflicts have made semiconductor manufacturing a key focus of government policy. As a world leader in integrated circuit (IC) design, design software, equipment, and research, the US has struggled in the past few years on the high yield volume manufacturing of the most advanced logic IC and failed to translate research innovations to quality production. Manufacturing, not innovation or equipment, is a key barrier of the US semiconductor industry. Two models for excellence in advanced manufacturing are described. Three pillars of government policy, global collaboration, and multicultural diversity empower semiconductor manufacturing excellence in Taiwan is described. An approach to evaluate, select, educate, and train manufacturing talents is proposed. Directions for semiconductor manufacturing research are discussed. There is no genius in semiconductor manufacturing, which requires extensive experience and continuous improvement without shortcuts to be competitive. The steadfast good government policy, multicultural diversity workforce, and global technology collaboration to achieve semiconductor manufacturing excellence are the focus of the conclusion.
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多元文化的多元化劳动力和全球技术合作助力台湾半导体制造业的卓越:制造工程师的视角
本文总结了一位制造业工程师对台湾过去五十年来政府政策、全球伙伴关系以及美国、日本、欧洲和中国传统文化的多样性如何造就半导体制造业人才队伍的看法。新冠肺炎疫情、供应链韧性、国家安全和地缘政治冲突等复杂交织的事件使半导体制造成为政府政策的重点。作为集成电路(IC)设计、设计软件、设备和研究的世界领导者,美国在过去几年中一直在努力实现最先进逻辑IC的高产量批量生产,未能将研究创新转化为高质量生产。制造业,而不是创新或设备,是美国半导体行业的一个关键障碍。介绍了先进制造业的两种卓越模式。介绍了政府政策、全球合作和多元文化多样性三大支柱为台湾半导体制造业的卓越发展奠定了基础。提出了一种评估、选拔、教育和培养制造业人才的方法。讨论了半导体制造研究的方向。半导体制造业没有天才,它需要丰富的经验和不断的改进,没有捷径可走,才能具有竞争力。坚定不移的良好政府政策、多元文化的多元化劳动力以及实现半导体制造卓越的全球技术合作是结论的重点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
6.80
自引率
20.00%
发文量
126
审稿时长
12 months
期刊介绍: Areas of interest including, but not limited to: Additive manufacturing; Advanced materials and processing; Assembly; Biomedical manufacturing; Bulk deformation processes (e.g., extrusion, forging, wire drawing, etc.); CAD/CAM/CAE; Computer-integrated manufacturing; Control and automation; Cyber-physical systems in manufacturing; Data science-enhanced manufacturing; Design for manufacturing; Electrical and electrochemical machining; Grinding and abrasive processes; Injection molding and other polymer fabrication processes; Inspection and quality control; Laser processes; Machine tool dynamics; Machining processes; Materials handling; Metrology; Micro- and nano-machining and processing; Modeling and simulation; Nontraditional manufacturing processes; Plant engineering and maintenance; Powder processing; Precision and ultra-precision machining; Process engineering; Process planning; Production systems optimization; Rapid prototyping and solid freeform fabrication; Robotics and flexible tooling; Sensing, monitoring, and diagnostics; Sheet and tube metal forming; Sustainable manufacturing; Tribology in manufacturing; Welding and joining
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