An ultrawideband Koch fractal patch antenna

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2023-07-06 DOI:10.1108/mi-12-2022-0201
Iqra Masroor, J. A. Ansari
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Abstract

Purpose Compact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of operating frequencies. The purpose of this paper is to propose a novel compact and ultrawideband (UWB) microstrip patch antenna intended for high frequency wireless applications. Design/methodology/approach A square microstrip patch antenna was initially modeled on finite element method-based electromagnetic simulation tool high frequency structure simulator. It was then loaded with a rectangular slit and Koch snowflake-shaped fractal notches for bandwidth enhancement. The fabricated prototype was tested by using vector network analyzer from Agilent Technologies, N5247A, Santa Clara, California, United States (US). Findings The designed Koch fractal patch antenna is highly compact with dimensions of 10 × 10 mm only and possesses UWB characteristics with multiple resonances in the operating band. The −10 dB measured impedance bandwidth was observed to be approximately 13.65 GHz in the frequency range (23.20–36.85 GHz). Originality/value Owing to its simple and compact structure, positive and substantial gain values, high radiation efficiency and stable radiation patterns throughout the frequency band of interest, the proposed antenna is a suitable candidate for high frequency wireless applications in the K (18–27 GHz) and Ka (26.5–40 GHz) microwave bands.
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一种超宽带Koch分形贴片天线
现代无线系统需要紧凑的宽带天线,这些天线最好与紧凑、低调和易于安装的设备一起工作,从而提供更广泛的工作频率覆盖。本文的目的是提出一种新型的小型超宽带微带贴片天线,用于高频无线应用。采用基于有限元法的电磁仿真工具high frequency structure simulator对方形微带贴片天线进行了初步建模。然后加载矩形狭缝和科赫雪花形分形缺口以增强带宽。利用美国加利福尼亚州圣克拉拉市安捷伦科技公司(Agilent Technologies, N5247A)的矢量网络分析仪对制造的原型进行了测试。结果:设计的科赫分形贴片天线结构紧凑,尺寸仅为10 × 10 mm,在工作频带内具有多共振的超宽带特性。−10 dB测量的阻抗带宽在23.20-36.85 GHz频率范围内约为13.65 GHz。该天线结构简单紧凑,增益值大,辐射效率高,在整个目标频段内辐射方向图稳定,是K (18-27 GHz)和Ka (26.5-40 GHz)微波频段高频无线应用的理想选择。
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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