Yumei Song, Jianzhang Hao, Changhao Dong, Xizheng Guo, Li Wang
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引用次数: 0
Abstract
Purpose
This paper aims to study a multi-level reinjection current source converter (MLR-CSC) that adds attracting properties such as the self-commutation and pulse multiplication to the thyristor converter, which is of great significance for increasing the device capacity and reducing current harmonics on the grid side. Particularly, designing advantageous driving methods of the reinjection circuit is a critical issue that impacts the harmonic reduction and operation reliability of the MLR-CSC.
Design/methodology/approach
To deal with the mentioned issue, this paper takes the five-level reinjection current source converter (FLR-CSC), which is a type of the MLR-CSC, as the research object. Then, a method that can fully use combinations of five-level reinjection switching functions based on the concept of decomposition and recombination is proposed. It is worthy to mention that the proposed method can be easily extended to other multi-level reinjection circuits. Moreover, the working principle of the three-phase bridge circuit based on semi-controlled thyristors in the FLR-CSC that can achieve the four-quadrant power conversion is analyzed in detail.
Findings
Finally, the simulation and experimental results of FLR-CSC verify the effectiveness of the proposed reinjection circuit driving method and the operating principle of four-quadrant power conversion in this paper.
Originality/value
The outstanding features of the proposed driving method for FLR-CSC in this paper include combinations of reinjection switching functions that are fully exploited through three simple steps and can be conveniently extended to other multi-level reinjection circuits.
期刊介绍:
Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.
Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing.