Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics International Pub Date : 2022-10-24 DOI:10.1108/mi-07-2021-0065
W. Filipowski
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Abstract

Purpose The purpose of this paper is to develop a model that allows determining the boron concentration profile in silicon based on duration and temperature of the diffusion process. Design/methodology/approach The model was developed on the basis of the Fick’s second law, which is fundamental for describing the diffusion process. The explicit scheme of the finite difference method was used in the conducted simulations. Results of measurements made using the secondary ion mass spectrometry (SIMS) were used as template dopant concentration profiles. Solution of boric acid in ethanol is the dopant source for which this model was developed. Findings Based on the conducted simulations, it was proposed that besides the influence of electric field of ionized dopants, which is already described in literature, an appropriate factor reflecting the influence of the threshold concentration on the coefficient of diffusion of boron in silicone should also be introduced. Originality/value The developed model enables determination of the boron concentration profile in silicon consistent with the results of SIMS measurements. A factor taking into account the influence of threshold concentration on the coefficient of diffusion was introduced. The influence of concentration of boric acid in the dopant solution on the concentration profile was also considered.
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基于硼酸溶液的太阳能电池用硅中硼扩散模型
本文的目的是建立一个模型,可以根据扩散过程的持续时间和温度来确定硅中的硼浓度分布。这个模型是根据菲克第二定律建立的,而菲克第二定律是描述扩散过程的基础。数值模拟采用有限差分法的显式格式。用二次离子质谱法(SIMS)测量的结果作为模板掺杂剂浓度谱。硼酸乙醇溶液是建立该模型的掺杂源。结果在模拟的基础上,提出除了文献中已经描述的电离掺杂剂电场的影响外,还应该引入一个合适的因子来反映阈值浓度对硼在硅中的扩散系数的影响。原创性/价值开发的模型能够确定硅中的硼浓度剖面与SIMS测量结果一致。介绍了一种考虑阈值浓度对扩散系数影响的因子。同时考虑了掺杂溶液中硼酸浓度对浓度分布的影响。
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来源期刊
Microelectronics International
Microelectronics International 工程技术-材料科学:综合
CiteScore
1.90
自引率
9.10%
发文量
28
审稿时长
>12 weeks
期刊介绍: Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details. Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are: • Advanced packaging • Ceramics • Chip attachment • Chip on board (COB) • Chip scale packaging • Flexible substrates • MEMS • Micro-circuit technology • Microelectronic materials • Multichip modules (MCMs) • Organic/polymer electronics • Printed electronics • Semiconductor technology • Solid state sensors • Thermal management • Thick/thin film technology • Wafer scale processing.
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