{"title":"Dynamic imaging of Ostwald ripening in copper oxide nanoparticles by atomic resolution transmission Electron microscope","authors":"Na Yeon Kim","doi":"10.1186/s42649-019-0019-z","DOIUrl":null,"url":null,"abstract":"<p>Structural evolution of copper oxide nanoparticles is examined, especially with respect to Ostwald ripening under electron beam irradiation. Dissolution of the smaller particles into the larger one was clearly observed at the atomic scale using advanced transmission electron microscope.</p>","PeriodicalId":470,"journal":{"name":"Applied Microscopy","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1186/s42649-019-0019-z","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Microscopy","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1186/s42649-019-0019-z","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Immunology and Microbiology","Score":null,"Total":0}
引用次数: 4
Abstract
Structural evolution of copper oxide nanoparticles is examined, especially with respect to Ostwald ripening under electron beam irradiation. Dissolution of the smaller particles into the larger one was clearly observed at the atomic scale using advanced transmission electron microscope.
Applied MicroscopyImmunology and Microbiology-Applied Microbiology and Biotechnology
CiteScore
3.40
自引率
0.00%
发文量
10
审稿时长
10 weeks
期刊介绍：
Applied Microscopy is a peer-reviewed journal sponsored by the Korean Society of Microscopy. The journal covers all the interdisciplinary fields of technological developments in new microscopy methods and instrumentation and their applications to biological or materials science for determining structure and chemistry. ISSN: 22875123, 22874445.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
