Assembled one-dimensional nanowires for flexible electronic devices via printing and coating: Techniques, applications, and perspectives

IF 15.9 1区 化学 Q1 CHEMISTRY, PHYSICAL Advances in Colloid and Interface Science Pub Date : 2023-11-01 DOI:10.1016/j.cis.2023.102987
Xin Xu , Pan Xue , Meng Gao , Yibin Li , Zijun Xu , Yu Wei , Zhengjian Zhang , Yang Liu , Lei Wang , Hongbin Liu , Bowen Cheng
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Abstract

The rapid progress in flexible electronic devices has necessitated continual research into nanomaterials, structural design, and fabrication processes. One-dimensional nanowires, characterized by their distinct structures and exceptional properties, are considered essential components for various flexible electronic devices. Considerable attention has been directed toward the assembly of nanowires, which presents significant advantages. Printing and coating techniques can be used to assemble nanowires in a relatively simple, efficient, and cost-competitive manner and exhibit potential for scale-up production in the foreseeable future. This review aims to provide an overview of nanowire assembly using printing and coating techniques, such as bar coating, spray coating, dip coating, blade coating, 3D printing, and so forth. The application of assembled nanowires in flexible electronic devices is subsequently discussed. Finally, further discussion is presented on the potential and challenges of flexible electronic devices based on assembled nanowires via printing and coating.

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通过印刷和涂层组装用于柔性电子设备的一维纳米线:技术、应用和前景。
柔性电子器件的快速发展要求对纳米材料、结构设计和制造工艺进行持续研究。一维纳米线以其独特的结构和优异的性能为特征,被认为是各种柔性电子设备的重要组成部分。纳米线的组装已经引起了相当大的关注,这具有显著的优势。印刷和涂层技术可用于以相对简单、高效和具有成本竞争力的方式组装纳米线,并在可预见的未来显示出扩大生产的潜力。这篇综述旨在概述使用印刷和涂层技术的纳米线组装,如棒涂、喷涂、浸涂、刮刀涂、3D打印等。随后讨论了组装纳米线在柔性电子器件中的应用。最后,进一步讨论了基于印刷和涂层组装纳米线的柔性电子器件的潜力和挑战。
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来源期刊
CiteScore
28.50
自引率
2.60%
发文量
175
审稿时长
31 days
期刊介绍: "Advances in Colloid and Interface Science" is an international journal that focuses on experimental and theoretical developments in interfacial and colloidal phenomena. The journal covers a wide range of disciplines including biology, chemistry, physics, and technology. The journal accepts review articles on any topic within the scope of colloid and interface science. These articles should provide an in-depth analysis of the subject matter, offering a critical review of the current state of the field. The author's informed opinion on the topic should also be included. The manuscript should compare and contrast ideas found in the reviewed literature and address the limitations of these ideas. Typically, the articles published in this journal are written by recognized experts in the field.
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