Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics

Anil Bastola , Yinfeng He , Jisun Im, Geoffrey Rivers, Feiran Wang, Robyn Worsley, Jonathan S. Austin, Oliver Nelson-Dummett, Ricky D. Wildman, Richard Hague, Christopher J. Tuck, Lyudmila Turyanska
{"title":"Formulation of functional materials for inkjet printing: A pathway towards fully 3D printed electronics","authors":"Anil Bastola ,&nbsp;Yinfeng He ,&nbsp;Jisun Im,&nbsp;Geoffrey Rivers,&nbsp;Feiran Wang,&nbsp;Robyn Worsley,&nbsp;Jonathan S. Austin,&nbsp;Oliver Nelson-Dummett,&nbsp;Ricky D. Wildman,&nbsp;Richard Hague,&nbsp;Christopher J. Tuck,&nbsp;Lyudmila Turyanska","doi":"10.1016/j.mtelec.2023.100058","DOIUrl":null,"url":null,"abstract":"<div><p>Inkjet printing offers a facile route for manufacturing the next generation of electronic devices, by combining the design freedom of additive manufacturing technologies with tuneable properties of functional materials and opportunities for their integration into heterostructures. However, to fully realise this potential, the library of functional materials available for additive manufacturing technologies needs to be expanded. In this review, we summarise current developments in ink formulation strategies, approaches for tailoring the functional properties of inks, and multi-material processing. Material – process – property relationships are reviewed for emerging functional materials, such as polymers, nanomaterials, and composites, with examples of current state-of-the-art devices. The flexibility of combining inkjet deposition with other existing technologies and a variety of substrates is also discussed reviewing current trends in electronics and optoelectronics, including wearable electronics, sensing, and energy applications. The review offers a comprehensive and systematic overview of ink formulations for inkjet deposition of electronic devices, summarising the challenges and perspectives in the advancement of 3D and multi-functional electronic devices and smart electronics.</p></div>","PeriodicalId":100893,"journal":{"name":"Materials Today Electronics","volume":"6 ","pages":"Article 100058"},"PeriodicalIF":0.0000,"publicationDate":"2023-09-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Today Electronics","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2772949423000347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Inkjet printing offers a facile route for manufacturing the next generation of electronic devices, by combining the design freedom of additive manufacturing technologies with tuneable properties of functional materials and opportunities for their integration into heterostructures. However, to fully realise this potential, the library of functional materials available for additive manufacturing technologies needs to be expanded. In this review, we summarise current developments in ink formulation strategies, approaches for tailoring the functional properties of inks, and multi-material processing. Material – process – property relationships are reviewed for emerging functional materials, such as polymers, nanomaterials, and composites, with examples of current state-of-the-art devices. The flexibility of combining inkjet deposition with other existing technologies and a variety of substrates is also discussed reviewing current trends in electronics and optoelectronics, including wearable electronics, sensing, and energy applications. The review offers a comprehensive and systematic overview of ink formulations for inkjet deposition of electronic devices, summarising the challenges and perspectives in the advancement of 3D and multi-functional electronic devices and smart electronics.

Abstract Image

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
喷墨打印功能材料的配方:通往全3D打印电子产品的途径
通过将增材制造技术的设计自由度与功能材料的可调谐特性相结合,以及将其集成到异质结构中的机会,喷墨打印为制造下一代电子设备提供了一条便捷的途径。然而,为了充分发挥这一潜力,需要扩大可用于增材制造技术的功能材料库。在这篇综述中,我们总结了油墨配方策略、定制油墨功能特性的方法和多材料加工的最新进展。材料-工艺-性质的关系,回顾了新兴的功能材料,如聚合物,纳米材料和复合材料,与当前最先进的设备的例子。本文还讨论了喷墨沉积与其他现有技术和各种衬底相结合的灵活性,回顾了电子和光电子学的当前趋势,包括可穿戴电子、传感和能源应用。本文对电子器件喷墨沉积的油墨配方进行了全面、系统的综述,总结了3D、多功能电子器件和智能电子器件的发展面临的挑战和前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
CiteScore
2.10
自引率
0.00%
发文量
0
期刊最新文献
Fabrication of bilayer ITO/YZO/PMMA/Al memory devices with insight ternary switching mechanism Thermoelectric performance of Cu3InSnSe5 and MnSe pseudo-binary solid solution Monolayer nodal line semimetal AgTe as gate-reconfigurable ‘cold’ Ohmic contact to 2D semiconductors MoSi2N4 and WSi2N4 Recent progress in the development of metal halide perovskite electronics for sensing applications Insight into the origins of mobility deterioration in indium phosphide-based epitaxial layer
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1