Circuits and devices for standalone large-scale integration (LSI) chips and Internet of Things (IoT) applications: a review

Chip Pub Date : 2023-09-01 DOI:10.1016/j.chip.2023.100048
Takaya Sugiura , Kenta Yamamura , Yuta Watanabe , Shiun Yamakiri , Nobuhiko Nakano
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引用次数: 5

Abstract

In recent years, Internet of Things (IoT) has become more and more important owing to the rapid expansion of the number of computing devices and data sizes. The evolution of IoT requires low-power and self-operating devices to expand the coverage area of computing resources. The main components of IoT are the large-scale integration (LSI) chips, which take the function of implementing the energy harvesters, control units and applications. They exhibit different physics or phenomena, making it difficult to understand and design the entire system. The current work reviews the various methods for IoT applications by CMOS LSI chips, from the power components by energy harvesting to realistic applications with future outlooks.

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用于独立大规模集成(LSI)芯片和物联网(IoT)应用的电路和设备:综述
近年来,由于计算设备数量和数据规模的快速扩张,物联网变得越来越重要。物联网的发展需要低功耗和自操作设备来扩大计算资源的覆盖范围。物联网的主要组件是大规模集成(LSI)芯片,它具有实现能量采集器、控制单元和应用程序的功能。它们表现出不同的物理或现象,使得理解和设计整个系统变得困难。目前的工作回顾了CMOS LSI芯片物联网应用的各种方法,从能量采集的功率组件到具有未来前景的现实应用。
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