{"title":"Will Silicon Survive Moore's Law?","authors":"L. Sheppard","doi":"10.1002/9780470588260.CH18","DOIUrl":null,"url":null,"abstract":"As device dimensions become smaller, chip manufacturers face material challenges to maintain performance.","PeriodicalId":7486,"journal":{"name":"American Ceramic Society Bulletin","volume":"59 6","pages":"121-127"},"PeriodicalIF":0.5000,"publicationDate":"2014-08-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1002/9780470588260.CH18","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"American Ceramic Society Bulletin","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1002/9780470588260.CH18","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, CERAMICS","Score":null,"Total":0}
引用次数: 0
Abstract
As device dimensions become smaller, chip manufacturers face material challenges to maintain performance.
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