{"title":"Microstructure analysis of 8 μm electrolytic Cu foil in plane view using EBSD and TEM","authors":"Myeongjin Kim, Hyun Soon Park","doi":"10.1186/s42649-022-00071-4","DOIUrl":null,"url":null,"abstract":"<div><p>With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.</p></div>","PeriodicalId":470,"journal":{"name":"Applied Microscopy","volume":"52 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-03-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://appmicro.springeropen.com/counter/pdf/10.1186/s42649-022-00071-4","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applied Microscopy","FirstCategoryId":"1085","ListUrlMain":"https://link.springer.com/article/10.1186/s42649-022-00071-4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Immunology and Microbiology","Score":null,"Total":0}
引用次数: 1
Abstract
With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.
Applied MicroscopyImmunology and Microbiology-Applied Microbiology and Biotechnology
CiteScore
3.40
自引率
0.00%
发文量
10
审稿时长
10 weeks
期刊介绍：
Applied Microscopy is a peer-reviewed journal sponsored by the Korean Society of Microscopy. The journal covers all the interdisciplinary fields of technological developments in new microscopy methods and instrumentation and their applications to biological or materials science for determining structure and chemistry. ISSN: 22875123, 22874445.
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