{"title":"Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni","authors":"J. S, Jacob Elias, M. Guru","doi":"10.1051/smdo/2020013","DOIUrl":null,"url":null,"abstract":"Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers. As a result of the ban on lead, electronics package industries were looking for novel lead free alloys which can substitute the conventional Sn-Pb alloy. Many alloys were discovered by the scientists. None of them were able to substitute the Sn-Pb alloy and become the market leader. In this paper a new composition with Sn, Cu and Ni is made to analyze which can potentially replace the lead containing solder alloy. Using the design of experiments method, the optimized composition of Cu and Ni is predicted. The full factorial design of experiments with two replications is used to find the optimized composition. Melting temperature, contact angle and hardness were taken as the critical output parameters. Results obtained shows that the optimum composition of Cu and Ni are 1 and 1% by wt.","PeriodicalId":37601,"journal":{"name":"International Journal for Simulation and Multidisciplinary Design Optimization","volume":"96 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1051/smdo/2020013","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal for Simulation and Multidisciplinary Design Optimization","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1051/smdo/2020013","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Mathematics","Score":null,"Total":0}
引用次数: 0
Abstract
Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers. As a result of the ban on lead, electronics package industries were looking for novel lead free alloys which can substitute the conventional Sn-Pb alloy. Many alloys were discovered by the scientists. None of them were able to substitute the Sn-Pb alloy and become the market leader. In this paper a new composition with Sn, Cu and Ni is made to analyze which can potentially replace the lead containing solder alloy. Using the design of experiments method, the optimized composition of Cu and Ni is predicted. The full factorial design of experiments with two replications is used to find the optimized composition. Melting temperature, contact angle and hardness were taken as the critical output parameters. Results obtained shows that the optimum composition of Cu and Ni are 1 and 1% by wt.
期刊介绍：
The International Journal for Simulation and Multidisciplinary Design Optimization is a peer-reviewed journal covering all aspects related to the simulation and multidisciplinary design optimization. It is devoted to publish original work related to advanced design methodologies, theoretical approaches, contemporary computers and their applications to different fields such as engineering software/hardware developments, science, computing techniques, aerospace, automobile, aeronautic, business, management, manufacturing,... etc. Front-edge research topics related to topology optimization, composite material design, numerical simulation of manufacturing process, advanced optimization algorithms, industrial applications of optimization methods are highly suggested. The scope includes, but is not limited to original research contributions, reviews in the following topics: Parameter identification & Surface Response (all aspects of characterization and modeling of materials and structural behaviors, Artificial Neural Network, Parametric Programming, approximation methods,…etc.) Optimization Strategies (optimization methods that involve heuristic or Mathematics approaches, Control Theory, Linear & Nonlinear Programming, Stochastic Programming, Discrete & Dynamic Programming, Operational Research, Algorithms in Optimization based on nature behaviors,….etc.) Structural Optimization (sizing, shape and topology optimizations with or without external constraints for materials and structures) Dynamic and Vibration (cover modelling and simulation for dynamic and vibration analysis, shape and topology optimizations with or without external constraints for materials and structures) Industrial Applications (Applications Related to Optimization, Modelling for Engineering applications are very welcome. Authors should underline the technological, numerical or integration of the mentioned scopes.).
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