H. Nawafune, Takashi Uegaki, S. Mizumoto, M. Ishikawa, Tsuneshi Nakamura
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引用次数: 9
Abstract
SummaryStudies have been made of an electroless copper-nickel-phosphorus alloy from a citrate complex bath using hypophosphite as reducing agent and electroless copper-nickel binary alloy from a triethanolamine complex bath using formaldehyde as reducing agent. With an increase in copper content of alloy, the specific resistance of deposit decreased. The TCR of copper-nickel-phosphorus alloy increased remarkably because of the crystallization of Ni3P after heat treatment. But the increase in TCR of copper-nickel binary alloy was moderate and not so striking as for the phosphorus containing alloy.
期刊介绍：
Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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