The role of Cu(II) in the process of forming non-stoichiometric copper sulphide coatings by a chemical route

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871241
J. Vinkevičius, A. Žielienė, G. Valiulienė
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引用次数: 5

Abstract

The composition of non-stoichiometric copper sulphide (Cu) coatings obtained during the interaction of Cu(II) with Na 2 S n (n = 1-4) has been investigated by cyclic voltammetry in 0.05 M H 2 SO 4 solution. The overall reaction has been shown to correspond to the equation. 4 Na 2 S 0 + 2 Cu(OH) 2ad →Cu 2 S ad + (4n-3) S 0 ad + 4 NaOH + 2 Na 2 S in which S o /Cu = (4n 3 1/2). Such a stoichiometry of reaction has been explained by the formation of an intermediate the adsorbed Cut II) polysulphide (Na 2 CuS n ) or a polynuclear complex (Na 2 Cu 2 S and its decomposition in simultaneous intramolecular redox reaction between Cu(II) and S 2 . When increasing n from I to 4/2-x) increases from 1.91 to 1.99 approximately.
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Cu(II)在化学途径形成非化学计量硫化铜涂层过程中的作用
在0.05 M h2so4溶液中,用循环伏安法研究了Cu(II)与na2sn (n = 1-4)相互作用得到的非化学计量的硫化铜(Cu)涂层的组成。总的反应已被证明符合这个方程。4na 2s0 + 2cu (OH) 2ad→cu2sad + (4n-3) s0 ad + 4naoh + 2na 2s,其中S o /Cu = (4n 3 1/2)。在Cu(II)和s2之间的分子内氧化还原反应中,吸附的Cut II多硫化物(Na 2cu n)或多核配合物(Na 2cu 2s)的形成及其分解可以解释这种化学计量。当n从1增加到4/2 (x)时,大约从1.91增加到1.99。
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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