Physical properties of Ni-Cu microlayer films obtained by pulse electrolysis

IF 1.2 4区材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871255

V. A. Zabludovsky, V. S. Gribok

引用次数: 1

Abstract

A new electrolytic technology for obtaining Ni-Cu multi-layers by program-controlled pulse current is suggested The mechanical and electrical properties of the coatings were explored and experimental data were compared with theoretical.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

脉冲电解镍铜微层薄膜的物理性质

提出了一种程控脉冲电流法制备Ni-Cu多层镀层的新工艺，并对镀层的力学性能和电学性能进行了研究，并将实验数据与理论数据进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Transactions of The Institute of Metal Finishing 工程技术-材料科学：膜

CiteScore

3.40

自引率

10.50%

发文量

审稿时长

3 months

期刊介绍： Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.