Cathode growth stability of electrodeposited metal matrix particulate composites

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871268
B. Bozzini
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引用次数: 1

Abstract

A simple model is proposed correlating operating conditions (electrochemical kinetic behaviour of the metal matrix deposition process, concentration of suspended particles, particle dimensions, hydrodynamic conditions) and cathode growth stability for electrodeposited metal matrix particulate composites with dispersions of non-conducling particies. Even though variations of all the considered variables have a bearing on growth stability, the most important single effect is polarisation (as, e.g., expressed by the local Tafel slope): the deposition of metal with high polarisation makes codeposition possible and renders viable the achievement of sufficiently smooth and thick materials; metals deposited at low overvoltage are mostly associated with unsuccessful composite plating The predictions of the model were confirmed with deposition experiments, cathode stability was judged according to SEM in-plane and cross-sectional micrographs as well as by roughness measurements.
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电沉积金属基颗粒复合材料的阴极生长稳定性
提出了一个简单的模型,将电沉积金属基颗粒复合材料的操作条件(金属基沉积过程的电化学动力学行为、悬浮颗粒浓度、颗粒尺寸、流体动力条件)和阴极生长稳定性与非导电颗粒的分散相关联。尽管所有考虑的变量的变化都对生长稳定性有影响,但最重要的单一影响是极化(例如,用局部塔菲尔斜率表示):高极化的金属沉积使共沉积成为可能,并使获得足够光滑和厚的材料成为可能;沉积实验证实了该模型的预测,并通过扫描电子显微镜(SEM)面内和截面显微照片以及粗糙度测量来判断阴极的稳定性。
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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