New insight into the anomalous codeposition of alloys

IF 1.2 4区 材料科学 Q4 ELECTROCHEMISTRY Transactions of The Institute of Metal Finishing Pub Date : 1999-01-01 DOI:10.1080/00202967.1999.11871271
Zelin Li, Jiale Cai, Shaomin Zhou
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引用次数: 4

Abstract

SUMMARYA new modelfor the anomalous codeposition of alloys is based on the kinetic characteristics of metal electrodeposition and the effect of hydrogen evolution accompanying the deposition. The less noble metal has intrinsically faster kinetics and so its deposition rate can be controlled mainly by diffusion mass transfer in a certain range of overpotentials; the convection induced by hydrogen evolution can speed up the relative deposition rate of this less noble metal when it is mainly diffusion-influenced. In contrast with previous models, such as the hydroxide suppression hypothesis, the monohydroxide-discharge-controlled mechanism, and the competitive adsorption effect, our model can explain naturally and completely anomalous codeposition, i.e. the preferential deposition of the less-noble metal, a problem in alloy electrodeposition that has persisted for a century.
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对合金异常共沉积的新认识
基于金属电沉积的动力学特征和伴随沉积的析氢效应,提出了一种新的合金异常共沉积模型。低贵金属本身具有更快的动力学,因此其沉积速率主要通过在一定过电位范围内的扩散传质来控制;当主要受扩散影响时,析氢引起的对流可以加快这种低贵金属的相对沉积速度。与氢氧化物抑制假说、单氢氧化物放电控制机制、竞争吸附效应等模型相比,我们的模型可以自然、完整地解释合金电沉积中存在了一个世纪的反常共沉积现象,即低贵金属的优先沉积现象。
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来源期刊
Transactions of The Institute of Metal Finishing
Transactions of The Institute of Metal Finishing 工程技术-材料科学:膜
CiteScore
3.40
自引率
10.50%
发文量
62
审稿时长
3 months
期刊介绍: Transactions of the Institute of Metal Finishing provides international peer-reviewed coverage of all aspects of surface finishing and surface engineering, from fundamental research to in-service applications. The coverage is principally concerned with the application of surface engineering and coating technologies to enhance the properties of engineering components and assemblies. These techniques include electroplating and electroless plating and their pre- and post-treatments, thus embracing all cleaning pickling and chemical conversion processes, and also complementary processes such as anodising. Increasingly, other processes are becoming important particularly regarding surface profile, texture, opacity, contact integrity, etc.
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