Influence of Heat Source Size on Phonon Transport in Thin Silicon Film

B. Yilbas, S. Bin Mansoor
{"title":"Influence of Heat Source Size on Phonon Transport in Thin Silicon Film","authors":"B. Yilbas, S. Bin Mansoor","doi":"10.1080/00411450.2013.853193","DOIUrl":null,"url":null,"abstract":"Energy transfer is mainly governed by the phonon transport in dielectric films. The polarization and dispersion of the phonons alter the thermal resistance of the film as the film size becomes comparable to the mean path of the substrate material. This is because of the quasi-ballistic behavior of the transport characteristics. In this case, the ballistic phonons do not undergo scattering in the film while suppressing the thermal resistance increase across the film. In the present study, the quasi-ballistic phonon transport and the effect of heat source size on the phonon transport characteristics are investigated in the two-dimensional silicon film. The heat source is located at one edge of the film while other edges assumed to be at uniform temperature. Since the Knudsen number is small (∼1), the Boltzmann transport equation is solved numerically, incorporating the polarization and dispersion of phonons, to obtain phonon intensity distribution in the film. Equivalent equilibrium temperature is introduced to assess the phonon intensity distribution in the film. The transient behavior of the phonon transport is incorporated in the analysis to predict the time to reach steady state value of equivalent temperature in the film. It is found that the size of the heat source has a significant effect on the phonon transport in the film. The effective thermal conductivity reduces significantly as the heat source size reduces.","PeriodicalId":49420,"journal":{"name":"Transport Theory and Statistical Physics","volume":"42 1","pages":"65 - 84"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1080/00411450.2013.853193","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Transport Theory and Statistical Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00411450.2013.853193","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

Abstract

Energy transfer is mainly governed by the phonon transport in dielectric films. The polarization and dispersion of the phonons alter the thermal resistance of the film as the film size becomes comparable to the mean path of the substrate material. This is because of the quasi-ballistic behavior of the transport characteristics. In this case, the ballistic phonons do not undergo scattering in the film while suppressing the thermal resistance increase across the film. In the present study, the quasi-ballistic phonon transport and the effect of heat source size on the phonon transport characteristics are investigated in the two-dimensional silicon film. The heat source is located at one edge of the film while other edges assumed to be at uniform temperature. Since the Knudsen number is small (∼1), the Boltzmann transport equation is solved numerically, incorporating the polarization and dispersion of phonons, to obtain phonon intensity distribution in the film. Equivalent equilibrium temperature is introduced to assess the phonon intensity distribution in the film. The transient behavior of the phonon transport is incorporated in the analysis to predict the time to reach steady state value of equivalent temperature in the film. It is found that the size of the heat source has a significant effect on the phonon transport in the film. The effective thermal conductivity reduces significantly as the heat source size reduces.
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热源尺寸对硅薄膜中声子输运的影响
介电薄膜中的能量传递主要由声子输运控制。声子的极化和色散改变了薄膜的热阻,因为薄膜尺寸变得与衬底材料的平均路径相当。这是由于输运特性的准弹道行为。在这种情况下,弹道声子在薄膜中不进行散射,同时抑制了薄膜上热阻的增加。本文研究了二维硅薄膜中的准弹道声子输运以及热源尺寸对声子输运特性的影响。热源位于薄膜的一边,而假定其他边处于均匀温度。由于Knudsen数很小(~ 1),因此将声子的极化和色散纳入玻尔兹曼输运方程进行数值求解,以获得声子在薄膜中的强度分布。引入等效平衡温度来评价声子在薄膜中的强度分布。在分析中考虑了声子输运的瞬态行为,以预测薄膜中达到等效温度稳态值的时间。研究发现,热源的大小对薄膜中的声子输运有显著影响。有效导热系数随着热源尺寸的减小而显著减小。
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来源期刊
Transport Theory and Statistical Physics
Transport Theory and Statistical Physics 物理-物理:数学物理
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