Assessing the Microfabrication-Related Variability of the Performance of CMUT Arrays

Monica La Mura;Alvise Bagolini;Patrizia Lamberti;Alessandro Stuart Savoia
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引用次数: 2

Abstract

This paper addresses the assessment of the variability of CMUT arrays’ electro-mechanical and acoustic performance, as related to the tolerance of the CMUT vertical dimensions due to the microfabrication process. A 3-factors 3-levels factorial sensitivity analysis is carried out to compute the main effects and the interaction effects of the moving plate thickness, the passivation layers thickness, and the sacrificial layer thickness, on the CMUT resonance frequency, collapse voltage, and static capacitance, as well as on the transmission and reception sensitivity amplitude and bandwidth and time delay in water-coupled condition. The analysis is performed by means of FEM simulations of the CMUT static behavior and dynamic response, and the findings are compared to experimental data.
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评估微加工相关的CMUT阵列性能变异性
本文讨论了CMUT阵列机电和声学性能可变性的评估,这与由于微加工过程导致的CMUT垂直尺寸公差有关。通过3因素3水平的析因灵敏度分析,计算了水耦合条件下动板厚度、钝化层厚度和牺牲层厚度对CMUT谐振频率、崩溃电压、静态电容以及收发灵敏度幅值、带宽和时延的主效应和交互效应。采用有限元模拟方法对CMUT的静态性能和动态响应进行了分析,并与实验数据进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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