Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections

Abstract

A nickel-tungsten alloy plating formula was developed to electrochemically fill the microvias of printed circuit boards and the through-silicon vias (TSVs) of wafers. The plating solution was composed of Ni(SO3NH2)2, citric acid, sodium citrate, Na2WO4, chloride ions, and 2-mercapto-5-benzimidazolesulfonic acid. A void-free Ni-W superfilling of a microvia and a TSV were achieved. The tungsten content in the filled alloy varied from 1.5 atom% to 5.5 atom%, depending on the plating temperature. The coefficient of thermal expansion of the filled Ni-W was theoretically calculated according the tungsten content, which was lower than that of copper. © The Author(s) 2015. Published by ECS. This is an open access article distributed under the terms of the Creative Commons Attribution 4.0 License (CC BY, http://creativecommons.org/licenses/by/4.0/), which permits unrestricted reuse of the work in any