Junlei Tang, Q. Zhu, Yan Zhang, Xiao Zhang, Jinsong Guo, J. Shang
{"title":"Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive","authors":"Junlei Tang, Q. Zhu, Yan Zhang, Xiao Zhang, Jinsong Guo, J. Shang","doi":"10.1149/2.0101509EEL","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":11470,"journal":{"name":"ECS Electrochemistry Letters","volume":"4 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2015-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1149/2.0101509EEL","citationCount":"34","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ECS Electrochemistry Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/2.0101509EEL","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}