Y-Function Analysis of the Low Temperature Behavior of Ultrathin Film FD SOI MOSFETs

IF 1.3 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Active and Passive Electronic Components Pub Date : 2014-06-11 DOI:10.1155/2014/697369
A. Karsenty, A. Chelly
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引用次数: 2

Abstract

The respective transfer characteristics of the ultrathin body (UTB) and gate recessed channel (GRC) device, sharing same W/L ratio but having a channel thickness of 46 nm, and 2.2 nm respectively, were measured at 300 K and at 77 K. By decreasing the temperature we found that the electrical behaviors of these devices were radically opposite: if for UTB device, the conductivity was increased, the opposite effect was observed for GRC. The low field electron mobility and series resistance values were extracted using a method based on Y-function for both the temperatures. If low values were found for UTB, very high values (g1) were extracted for GRC. Surprisingly, for the last device, the effective field mobility is found very low (l1) and is decreasing by lowering the temperature. After having discussed the limits of this analysis.This case study illustrates the advantage of the Y-analysis in discriminating a parameter of great relevance for nanoscale devices and gives a coherent interpretation of an anomalous electrical behavior.
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超薄膜FD SOI mosfet低温行为的y函数分析
在300 K和77 K温度下,测量了具有相同W/L比、通道厚度分别为46 nm和2.2 nm的超薄体(UTB)和栅极凹槽沟道(GRC)器件的传递特性。通过降低温度,我们发现这些器件的电学行为完全相反:如果对于UTB器件,电导率增加,则对于GRC器件观察到相反的效果。利用基于y函数的方法提取了两种温度下的低场电子迁移率和串联电阻值。如果发现UTB值较低,则提取GRC值非常高(g1)。令人惊讶的是,对于最后一个器件,发现有效场迁移率非常低(l1),并且随着温度的降低而降低。在讨论了这种分析的局限性之后。本案例研究说明了y分析在鉴别与纳米级器件非常相关的参数方面的优势,并给出了异常电行为的连贯解释。
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来源期刊
Active and Passive Electronic Components
Active and Passive Electronic Components ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
1.30
自引率
0.00%
发文量
1
审稿时长
13 weeks
期刊介绍: Active and Passive Electronic Components is an international journal devoted to the science and technology of all types of electronic components. The journal publishes experimental and theoretical papers on topics such as transistors, hybrid circuits, integrated circuits, MicroElectroMechanical Systems (MEMS), sensors, high frequency devices and circuits, power devices and circuits, non-volatile memory technologies such as ferroelectric and phase transition memories, and nano electronics devices and circuits.
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