{"title":"Modular Design of Short-Distance Wireless Audio Transmission System","authors":"崇锦 仲","doi":"10.12677/hjwc.2023.133003","DOIUrl":null,"url":null,"abstract":"This article designs a short-distance wireless transmission system for audio signals based on infra-red light communication, using infrared light emitting diodes and infrared light receiving modules as transmitting and receiving devices. Within a transmission distance of 1 m, the short-distance wireless transmission of audio signals is achieved. The system is different from previous chip modules based on relatively fixed parameters and functions, but adopts a discrete modular design. The functional modules of the transmitting and receiving components are independent and inter-connected, allowing for convenient module replacement and re-configurable technology updates and upgrades under the conditions of functional implementation.","PeriodicalId":66606,"journal":{"name":"无线通信","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"无线通信","FirstCategoryId":"1093","ListUrlMain":"https://doi.org/10.12677/hjwc.2023.133003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This article designs a short-distance wireless transmission system for audio signals based on infra-red light communication, using infrared light emitting diodes and infrared light receiving modules as transmitting and receiving devices. Within a transmission distance of 1 m, the short-distance wireless transmission of audio signals is achieved. The system is different from previous chip modules based on relatively fixed parameters and functions, but adopts a discrete modular design. The functional modules of the transmitting and receiving components are independent and inter-connected, allowing for convenient module replacement and re-configurable technology updates and upgrades under the conditions of functional implementation.