{"title":"Synopsis of the June 2023 Issue of the IEEE Letters on Electromagnetic Compatibility Practice and Applications","authors":"","doi":"10.1109/LEMCPA.2023.3275008","DOIUrl":null,"url":null,"abstract":"Summary form only: Abstracts of articles presented in this issue of the publication.","PeriodicalId":100625,"journal":{"name":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","volume":"5 2","pages":"34-36"},"PeriodicalIF":0.9000,"publicationDate":"2023-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/iel7/8566057/10136242/10136355.pdf","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Letters on Electromagnetic Compatibility Practice and Applications","FirstCategoryId":"1085","ListUrlMain":"https://ieeexplore.ieee.org/document/10136355/","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Summary form only: Abstracts of articles presented in this issue of the publication.
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