A Matlab/Simulink 3D model of unsymmetrical ultrasonic sandwich transducers

Igor Jovanović, Ugljesa Jovanovic, D. Mančić
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Abstract

Ultrasonic sandwich transducer is a half-wave resonant structure which oscillates in thickness direction. This paper presents a new Matlab/ Simulink model of a prestressed unsymmetrical ultrasonic sandwich transducer, which is modeled by applying three-dimensional (3D) Matlab/Simulink models of piezoceramic rings and metal endings derived from the piezoceramic ring model. With the cascade connection of the piezoceramic rings model with metal endings model, a complete model of ultrasonic transducer is obtained. Using this model one may determine any transducer transfer function, whereat is taken into the account the external medium influence, as well as the influence of the thickness and radial modes of each transducer component. The electromechanical equivalent circuit of the hammer transducer, which represents onedimensional (1D) model, is also derived and presented in this paper. The comparisons between experimental and theoretical results are quite good and validate the new analytical 3D design approach.
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非对称超声夹层换能器的Matlab/Simulink三维模型
超声夹层换能器是一种沿厚度方向振荡的半波谐振结构。本文提出了一种新的预应力非对称超声夹层换能器的Matlab/Simulink模型,该模型采用由压电陶瓷环模型导出的压电陶瓷环和金属端部的三维Matlab/Simulink模型进行建模。将压电陶瓷环模型与金属末端模型串接,得到了超声换能器的完整模型。使用该模型可以确定任何换能器传递函数,其中考虑了外部介质影响,以及每个换能器组件的厚度和径向模式的影响。文中还推导并给出了锤式换能器机电等效电路的一维模型。实验结果与理论结果比较良好,验证了新的解析式三维设计方法。
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来源期刊
Serbian Journal of Electrical Engineering
Serbian Journal of Electrical Engineering Energy-Energy Engineering and Power Technology
CiteScore
1.30
自引率
0.00%
发文量
16
审稿时长
25 weeks
期刊介绍: The main aims of the Journal are to publish peer review papers giving results of the fundamental and applied research in the field of electrical engineering. The Journal covers a wide scope of problems in the following scientific fields: Applied and Theoretical Electromagnetics, Instrumentation and Measurement, Power Engineering, Power Systems, Electrical Machines, Electrical Drives, Electronics, Telecommunications, Computer Engineering, Automatic Control and Systems, Mechatronics, Electrical Materials, Information Technologies, Engineering Mathematics, etc.
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