Ultrasonic soldering of Al2O3 ceramics and Ni-SiC composite by use of Bi-based active solder

IF 1.4 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY AIMS Materials Science Pub Date : 2023-01-01 DOI:10.3934/matersci.2023012
Tomáš Meluš, R. Koleňák, J. Drápala, P. Babincová, Matej Pašák
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Abstract

The aim of this research was to study the interaction and solderability of Al2O3 ceramics and Ni-SiC composite by use of an active solder type Bi11Ag1.5Ti1Mg. The chemical composition of the solder is 86.5 wt% Bi, 11 wt% Ag, 1.5 wt% Ti, 1 wt% Mg. Soldering was performed by ultrasonic activation. This solder has a wide melting interval with the initial melting temperature of 263 ℃, what corresponds to the eutectic reaction. The liquidus temperature of this solder was determined at 437 ℃. The bond between the ceramic and the solder is formed by the interaction of the active metals Bi, Ag and Mg with the surface of the substrate Al2O3. The thickness of the Mg reaction layer at the interface was approximately 0.8 μm. The bond at the interface between Ni-SiC and solder was formed due to the interaction of the active metals Bi, Ag, Mg and Ti. Feasibility of Bi11Ag1.5Ti1Mg solder was assessed on the basis of analyses of joint boundaries and joint shear strength measurements. The average shear strength of Al2O3/Bi11Ag1.5Ti1Mg/Ni-SiC joint was 54 MPa.
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利用铋基活性焊料对Al2O3陶瓷和Ni-SiC复合材料进行超声波焊接
本研究的目的是利用活性焊料Bi11Ag1.5Ti1Mg研究Al2O3陶瓷与Ni-SiC复合材料的相互作用和可焊性。焊料的化学成分为86.5 wt% Bi, 11wt % Ag, 1.5 wt% Ti, 1wt % Mg。用超声波活化进行焊接。该焊料具有较宽的熔化间隔,初熔温度为263℃,与共晶反应相对应。测定了该焊料的液相温度为437℃。陶瓷和焊料之间的结合是由活性金属Bi、Ag和Mg与衬底表面Al2O3的相互作用形成的。界面处的Mg反应层厚度约为0.8 μm。活性金属Bi、Ag、Mg和Ti的相互作用形成了Ni-SiC与钎料界面的键合。通过对接头边界的分析和接头抗剪强度的测定,对Bi11Ag1.5Ti1Mg焊料的可行性进行了评价。Al2O3/Bi11Ag1.5Ti1Mg/Ni-SiC接头的平均抗剪强度为54 MPa。
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来源期刊
AIMS Materials Science
AIMS Materials Science MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
3.60
自引率
0.00%
发文量
33
审稿时长
4 weeks
期刊介绍: AIMS Materials Science welcomes, but not limited to, the papers from the following topics: · Biological materials · Ceramics · Composite materials · Magnetic materials · Medical implant materials · New properties of materials · Nanoscience and nanotechnology · Polymers · Thin films.
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