A graphical method to obtain the implantation regime required for heavily doped deep semiconductor junctions

B. Raicu
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Abstract

This paper describes a fast method to calculate the implantation parameters (φ, E) required in order to obtain a given concentration profile after annealing and driven-in diffusion (Cs, Cb, xj) for thick junctions xxj > 10h, where h = 2Rp). The method is usable for final Gaussian concentration profiles peaked at the SiO2/Si interface or at the substrate surface and can be employed for bipolar transistors and buried layers in IC technology.

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获得重掺杂深半导体结所需注入状态的图解方法
本文描述了一种快速计算厚结xxj>;退火后获得给定浓度分布和驱动扩散(Cs,Cb,xj)所需注入参数(φ,E)的方法;其中h=2Rp)。该方法可用于在SiO2/Si界面或衬底表面达到峰值的最终高斯浓度分布,并且可用于IC技术中的双极晶体管和埋层。
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