Combined heat conductive boards with polyimide dielectrics

IF 0.2 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Visnyk NTUU KPI Seriia-Radiotekhnika Radioaparatobuduvannia Pub Date : 2023-03-28 DOI:10.30837/rt.2023.1.212.10
V. Borshchov, O. Listratenko, M. Protsenko, I. Tymchuk, O.V. Kravchenko, O.V. Syddia, I.V. Borshchov, M. Slipchenko
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Abstract

Heat-conductive properties of thin heat-conductive polyimide dielectrics have been studied and their thermal resistances have been calculated. Possibility of creating combined printed circuit boards on heat-conductive bases with reduced thermal resistances of polyimide dielectrics from ~ 0.2 to ~ 0.04 °С /W is confirmed. Design parameters and thermal properties of the combined boards with thin polyimide (PI) dielectrics for receivers of concentrated solar radiation are studied. Possibility of providing thermal resistances of PI dielectrics not exceeding 0.43 °С/W has been confirmed. Technical solutions of volumetric light-emitting diode (LED) modules on combined heat-conductive boards, which are 3D-holders-heat sinks, made in the form of single heat-conductive light-reflecting mirrored element, are studied. High thermal characteristics of the modules were achieved due to increase in the area of heat sink holders by more than 2.5 – 3 times compared to flat-type LED modules. Scientific and technical sources were analyzed for selection of modern polyimide materials intended for development and manufacture of combined boards on heat-conductive bases with dielectrics made of polyimide films with increased thermal conductivity up to 0.36 – 0.75 W/(m•K). Potential possibility of creating effective combined printed circuit boards on heat-conductive basis, including those that can be bent, is confirmed using modern industrially manufactured thin heat-conductive PI films with heat-sealable thermoplastic coatings that provide the value of total thermal resistance of boards from 1.5 up to 2.8 °C•cm2/W.
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聚酰亚胺电介质复合导热板
研究了薄型导热聚酰亚胺电介质的导热性能,并计算了其热阻。在聚酰亚胺电介质的热阻从~ 0.2°降至~ 0.04°С /W的导热基上制造组合印刷电路板的可能性得到证实。研究了聚酰亚胺(PI)薄介质复合板的设计参数和热性能。提供PI介电材料热阻不超过0.43°С/W的可能性已得到证实。研究了三维支架-散热片复合导热板上体积发光二极管(LED)模块的技术解决方案。与平板型LED模组相比,由于散热器支架的面积增加了2.5 - 3倍以上,模组的高热特性得以实现。分析了现代聚酰亚胺材料的科学和技术来源,用于开发和制造导热基上的组合板,其电介质由聚酰亚胺薄膜制成,导热系数提高到0.36 - 0.75 W/(m•K)。利用现代工业制造的导热PI薄膜和可热封的热塑性涂层,在导热基础上制造有效的组合印刷电路板(包括可弯曲的印刷电路板)的潜在可能性得到了证实,这些薄膜可提供电路板的总热阻值,从1.5到2.8°C•cm2/W。
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Visnyk NTUU KPI Seriia-Radiotekhnika Radioaparatobuduvannia
Visnyk NTUU KPI Seriia-Radiotekhnika Radioaparatobuduvannia ENGINEERING, ELECTRICAL & ELECTRONIC-
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