Analytical Performance Modeling of Hierarchical Interconnect Fabrics

N. Nikitin, Javier de San Pedro, J. Carmona, J. Cortadella
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引用次数: 13

Abstract

The continuous scaling of nanoelectronics is increasing the complexity of chip multiprocessors (CMPs) and exacerbating the memory wall problem. As CMPs become more complex, the memory subsystem is organized into more hierarchical structures to better exploit locality. During the exploration and design of CMP architectures, it is essential to efficiently analyze their performance. However, performance is highly determined by the latency of the memory subsystem, which in turn has a cyclic dependency with the memory traffic generated by the cores. This paper proposes a scalable analytical method to estimate the performance of highly parallel CMPs (hundreds of cores) with hierarchical interconnect fabrics. The method can use customizable probabilistic models and solves the cyclic dependencies by using a fixed-point strategy. The technique is shown to be a very accurate and efficient strategy when compared to the results obtained by simulation.
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分层互连结构的分析性能建模
纳米电子学的不断扩展增加了芯片多处理器(cmp)的复杂性,加剧了存储壁问题。随着cmp变得越来越复杂,内存子系统被组织成更多的层次结构,以更好地利用局部性。在CMP体系结构的探索和设计过程中,有效地分析其性能是至关重要的。然而,性能在很大程度上取决于内存子系统的延迟,而内存子系统又与内核生成的内存流量具有循环依赖关系。本文提出了一种可扩展的分析方法来估计具有分层互连结构的高度并行cmp(数百核)的性能。该方法采用可定制的概率模型,采用不动点策略求解循环依赖关系。仿真结果表明,该方法是一种非常精确和有效的策略。
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