Surface analysis of demages on escherichia coli caused by oxygen plasma radicals

K. Eleršič, Z. Vratnica, D. Vujošević, I. Junkar, J. Kovač, M. Mozetič, U. Cvelbar
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Abstract

Inductively coupled oxygen plasma was used to study degradation of Escherichia coli. Bacteria were deposited on a silicon wafer substrate and treated by plasma for different periods. The effect of oxygen plasma ions and neutral oxygen atoms was observed by atomic force microscopy (AFM) and scanning electron microscopy (SEM). The first effect was removal of the envelope - a protective coating bacteria developed during growing. After removing the envelope (capsule), slow etching of the cell wall was observed. Further treatment resulted in gradual removal of the cell wall and after 240s, only ashes remained. Images of plasma interaction steps during bacteria degradation are presented and the plasma radical interaction steps explained by observed damages of bacteria.
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氧等离子体自由基对大肠杆菌损伤的表面分析
采用电感耦合氧等离子体对大肠杆菌的降解进行了研究。将细菌沉积在硅片衬底上,用等离子体处理不同时间。通过原子力显微镜(AFM)和扫描电镜(SEM)观察了氧等离子体离子和中性氧原子的作用。第一个效果是去除包膜——细菌在生长过程中形成的一种保护性涂层。去除包膜(囊)后,观察到细胞壁的缓慢蚀刻。进一步处理导致细胞壁逐渐去除,240s后只剩下灰烬。给出了细菌降解过程中等离子体相互作用步骤的图像,并用观察到的细菌损伤解释了等离子体自由基相互作用步骤。
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