BGA Solder Balls Formation by Induction Heating

V. Lanin, Ivan I. Sergachou, Vitaly T. Khotskin
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引用次数: 2

Abstract

Induction devices with open magnetic circuit are efficient for forming solder balls from solder paste on contact pads PCB. Local distribution of eddy currents in solder balls it is possible to provide by optimize frequency and amplitude of the excitation current in inductor. Realization of the high-speed induction heating solder balls in frequencies range from 500 to 1000 kHz are suitable in the magnetic circuit gap of inductor device.
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感应加热形成BGA焊料球
采用开路磁路的感应装置可以有效地将触点板上的锡膏形成锡球。通过优化电感励磁电流的频率和幅值,可以实现焊锡球内涡流的局部分布。实现频率在500 ~ 1000khz范围内的高速感应加热焊锡球,适用于电感器件的磁路间隙。
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