Development of high efficiency wafer bonded 4-junction solar cells for concentrator photovoltaic applications

F. Dimroth, T. Tibbits, Paul Beutel, C. Karcher, E. Oliva, G. Siefer, M. Schachtner, A. Wekkeli, M. Steiner, M. Wiesenfarth, A. Bett, R. Krause, E. Gerster, M. Piccin, N. Blanc, M. Rico, C. Drazek, E. Guiot, J. Wasselin, C. Arena, T. Salvetat, A. Tauzin, T. Signamarcheix, T. Hannappel
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引用次数: 25

Abstract

The next generation of multi-junction concentrator solar cells will have to reach higher efficiencies than today's devices. At the same time these solar cells must be reliable in the field, be manufacturable with good yield and at sufficiently low cost. Inevitably the request of higher efficiency requires four or even more junction devices. A four-junction solar cell combination of GaInP/GaAs//GaInAsP/GaInAs with bandgap energies of 1.9, 1.4, 1.1, 0.7 eV is developed in a close collaboration between the Fraunhofer ISE, Soitec, CEA-LETI and HZB. This 4-junction cell hits close to the optimum of theoretical efficiency contour plots and has the potential to reach efficiencies up to 50 % under concentration. Challenges are associated with lattice-mismatch between GaAs and InP which is overcome by direct wafer-bonding. The high cost of the InP is addressed by the use of engineered substrates which only require a 500 nm thin mono-crystalline InP layer instead of several hundred μm. Excellent solar cell results up to 44.7 % efficiency have been obtained under concentration for devices manufactured on InP bulk substrates. The high cell efficiency is also supported by out-door characterization of one cell below a Fresnel lens with 16 cm2 aperture area. 38.5 % conversion efficiency has been measured for this mono-module in Freiburg under real operating conditions without any corrections.
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聚光光伏用高效晶圆键合四结太阳能电池的研制
下一代多结聚光太阳能电池必须达到比今天的设备更高的效率。与此同时,这些太阳能电池必须在现场可靠,产量高,成本足够低。提高效率的要求不可避免地需要四个甚至更多的结器件。在Fraunhofer ISE, Soitec, CEA-LETI和HZB的密切合作下,开发了一种带隙能量为1.9,1.4,1.1,0.7 eV的GaInP/GaAs//GaInAsP/GaInAs的四结太阳能电池。这种4结电池接近理论效率轮廓图的最佳值,并且在浓度下有可能达到高达50%的效率。挑战与GaAs和InP之间的晶格不匹配有关,这是通过直接晶圆键合来克服的。InP的高成本是通过使用工程衬底来解决的,它只需要500纳米薄的单晶InP层,而不是几百μm。对于在InP基片上制造的器件,在浓缩条件下获得了高达44.7%的效率。高电池效率也支持了一个菲涅耳透镜下的一个电池的室外表征,孔径面积为16平方厘米。该单模组在弗莱堡实际运行条件下的转换效率为38.5%,没有任何修正。
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