Hybrid Au-underfill resin bonding with lock-and-key structure

M. Nimura, A. Shigetou, K. Sakuma, H. Ogino, T. Enomoto, J. Mizuno, S. Shoji
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引用次数: 4

Abstract

We developed a novel hybrid bonding technology for Au ultralow-profiled bumps and underfill resin with a modified “lock-and-key structure.” The lock structure interlocks with the key structure. We applied these structures to perform an entire adhesion between the mating surfaces in place of conventional underfilling technique. To fabricate the key structure, we developed a simple process that can remove resin on the bumps. Lock structure was fabricated by photolithography and dry etching. After the bonding was carried out, the bonded interface was observed with a Scanning Electron Microscope (SEM), a transmission electron microscope (TEM) and a Scanning Acoustic Microscope (SAM). The results proved that no significant gap was existed at both Au-Au and resin-resin interface. Furthermore, the shear strength of the bonded sample with resin was ten times stronger than that without resin. The conduction of Au bump connections after hybrid bonding was also confirmed.
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具有锁-钥匙结构的复合金填充树脂键合
我们开发了一种新型的混合键合技术,用于Au超低轮廓凸起和底部填充树脂,该技术具有改进的“锁与钥匙结构”。锁结构与钥匙结构互锁。我们应用这些结构在配合表面之间执行整个粘合,以取代传统的下填技术。为了制造关键结构,我们开发了一种简单的工艺,可以去除凸起上的树脂。采用光刻法和干蚀刻法制备锁结构。键合完成后,用扫描电镜(SEM)、透射电镜(TEM)和扫描声学显微镜(SAM)对键合界面进行观察。结果表明,Au-Au和树脂-树脂界面均不存在明显的间隙。此外,树脂粘接样品的抗剪强度比不加树脂的高10倍。杂化键合后金凹凸连接的传导也得到了证实。
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