T. Thanh, N. Blanc, N. Boudet, E. Bourjot, S. Zhiou, V. Kovacova, P. Rodriguez, F. Nemouchi, P. Gergaud
{"title":"Full 3D reciprocal space map of thin polycrystalline films for microelectronic applications","authors":"T. Thanh, N. Blanc, N. Boudet, E. Bourjot, S. Zhiou, V. Kovacova, P. Rodriguez, F. Nemouchi, P. Gergaud","doi":"10.1109/IITC-MAM.2015.7325624","DOIUrl":null,"url":null,"abstract":"We introduce a full 3D reciprocal space map (RSM) measurement technique developed at the BM02 beamline (ESRF) in the framework of ultrathin polycrystalline films for microelectronic applications. This technique gives a complete overview of the reciprocal space in a large range of Bragg angles to detect and characterize the nature and texture of all phases present in a polycrystalline film. As a demonstration for this technique we have performed 3D RSM measurement on several kinds of samples: Ni-based germano-silicide on silicon for source/drain contacts in the framework of sub-20 nm FD-SOI transistors; Ni-based alloyed with III-V materials for power electronics application; and PZT thin films on silicon substrate for MEMS applications. New software (DEVA) is developed in pure Python language in order to quickly automatically and on line treat these multidimensional data, taking into account the specific geometry of our area detector XPAD.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"90 1","pages":"53-56"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC-MAM.2015.7325624","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
We introduce a full 3D reciprocal space map (RSM) measurement technique developed at the BM02 beamline (ESRF) in the framework of ultrathin polycrystalline films for microelectronic applications. This technique gives a complete overview of the reciprocal space in a large range of Bragg angles to detect and characterize the nature and texture of all phases present in a polycrystalline film. As a demonstration for this technique we have performed 3D RSM measurement on several kinds of samples: Ni-based germano-silicide on silicon for source/drain contacts in the framework of sub-20 nm FD-SOI transistors; Ni-based alloyed with III-V materials for power electronics application; and PZT thin films on silicon substrate for MEMS applications. New software (DEVA) is developed in pure Python language in order to quickly automatically and on line treat these multidimensional data, taking into account the specific geometry of our area detector XPAD.