N. Sidorenko, Yaakov B. Unigovski, Z. Dashevsky, R. Shneck
{"title":"A Novel Method to Significantly Improve the Mechanical Properties of n-Type Bi(1−x)Sbx Thermoelectrics Due to Plastic Deformation","authors":"N. Sidorenko, Yaakov B. Unigovski, Z. Dashevsky, R. Shneck","doi":"10.3390/electronicmat2040036","DOIUrl":null,"url":null,"abstract":"A unique method was developed to significantly improve the strength of Bi(1−x)Sbx single crystals, the most effective thermoelectric (TE) materials in the temperature range from 100 to 200 K due to their plastic deformation by extrusion. After plastic deformation at room temperature under all-round hydrostatic compression in a liquid medium, n-type Bi–Sb polycrystalline solid solutions show a significant increase in mechanical strength compared to Bi–Sb single crystals in the temperature range from 300 to 80 K. The significantly higher strength of extruded alloys in comparison with Bi–Sb single crystals is associated with the development of numerous grains with a high boundary surface as well as structural defects, such as dislocations, that accumulate at grain boundaries. Significant stability of the structure of extruded samples is achieved due to the uniformity of crystal plastic deformation under all-round hydrostatic compression and the formation of the polycrystalline structure consisting of grains with the orientation of the main crystallographic directions close to the original single crystal. The strengthening of Bi–Sb single crystals after plastic deformation allows for the first time to create workable TE devices that cannot be created on the basis of single crystals that have excellent TE properties, but low strength.","PeriodicalId":18610,"journal":{"name":"Modern Electronic Materials","volume":"411 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Modern Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/electronicmat2040036","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A unique method was developed to significantly improve the strength of Bi(1−x)Sbx single crystals, the most effective thermoelectric (TE) materials in the temperature range from 100 to 200 K due to their plastic deformation by extrusion. After plastic deformation at room temperature under all-round hydrostatic compression in a liquid medium, n-type Bi–Sb polycrystalline solid solutions show a significant increase in mechanical strength compared to Bi–Sb single crystals in the temperature range from 300 to 80 K. The significantly higher strength of extruded alloys in comparison with Bi–Sb single crystals is associated with the development of numerous grains with a high boundary surface as well as structural defects, such as dislocations, that accumulate at grain boundaries. Significant stability of the structure of extruded samples is achieved due to the uniformity of crystal plastic deformation under all-round hydrostatic compression and the formation of the polycrystalline structure consisting of grains with the orientation of the main crystallographic directions close to the original single crystal. The strengthening of Bi–Sb single crystals after plastic deformation allows for the first time to create workable TE devices that cannot be created on the basis of single crystals that have excellent TE properties, but low strength.