V. N. N. T. Rambhatla, David Samet, S. McCann, S. Sitaraman
{"title":"A Characterization Method for Interfacial Delamination of Copper/Epoxy Mold Compound Specimens under Mixed Mode I/III Loading","authors":"V. N. N. T. Rambhatla, David Samet, S. McCann, S. Sitaraman","doi":"10.1109/ECTC.2017.291","DOIUrl":null,"url":null,"abstract":"The objective of this work is to develop a combinedmode I and mode III characterization method and to use thistest method to study Copper (Cu) / Epoxy mold compound(EMC) interfacial delamination from near-mode I to nearmodeIII global loading. Using the developed test method, aseries of experiments are done with varying loading modeconditions from near-mode I to near-mode III and successfuldelamination of the Cu/EMC interface is observed in manycases. Three-dimensional finite-element analysis is carried outto get compliance vs crack length relationship for differentloading conditions and is used to determine the crack lengthindirectly. The experiments indicate that as the mode mixityincreases from mode I towards mode III, the critical loadincreases for a given crack length, and thus, the interfacialfracture energy increases with the increasing mode mixity.","PeriodicalId":6557,"journal":{"name":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","volume":"34 1","pages":"1888-1893"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2017.291","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The objective of this work is to develop a combinedmode I and mode III characterization method and to use thistest method to study Copper (Cu) / Epoxy mold compound(EMC) interfacial delamination from near-mode I to nearmodeIII global loading. Using the developed test method, aseries of experiments are done with varying loading modeconditions from near-mode I to near-mode III and successfuldelamination of the Cu/EMC interface is observed in manycases. Three-dimensional finite-element analysis is carried outto get compliance vs crack length relationship for differentloading conditions and is used to determine the crack lengthindirectly. The experiments indicate that as the mode mixityincreases from mode I towards mode III, the critical loadincreases for a given crack length, and thus, the interfacialfracture energy increases with the increasing mode mixity.
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