Silicon Vertex & Tracking Detectors for the Compact Linear Collider

S. Spannagel
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引用次数: 4

Abstract

CLIC is a proposed linear $e^+e^-$ collider with center-of-mass energies of up to 3 TeV. Its main objectives are precise top quark, Higgs boson and Beyond Standard Model physics. In addition to spatial resolutions of a few micrometers and a very low material budget, the vertex and tracking detectors also require timing capabilities with a precision of a few nanoseconds to allow suppression of beam-induced background particles. Different technologies using hybrid silicon detectors are explored for the vertex detectors, such as dedicated 65 nm readout ASICs, small-pitch sensors as well as bonding using anisotropic conductive films. Monolithic sensors are the current choice for the tracking detector, and a prototype using a 180 nm high-resistivity CMOS process has been designed and produced, and is currently under evaluation. Different designs using a silicon-on-insulator process are under investigation for both vertex and tracking detector. All prototypes are tested in laboratory and beam tests, and newly developed simulation tools combining Geant4 and TCAD are used to assess and optimize their performance. This contribution gives an overview of the R&D program for the CLIC vertex and tracking detectors, highlighting new results from the prototypes.
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用于紧凑型线性对撞机的硅顶点和跟踪探测器
CLIC是一种被提议的线性$e^+ $e^ -$对撞机,质心能量高达3 TeV。它的主要目标是精确顶夸克、希格斯玻色子和超越标准模型物理学。除了几微米的空间分辨率和非常低的材料预算外,顶点和跟踪探测器还需要精确到几纳秒的定时能力,以抑制光束引起的背景粒子。对于顶点探测器,我们探索了使用混合硅探测器的不同技术,例如专用的65nm读出asic,小间距传感器以及使用各向异性导电薄膜的键合。单片传感器是目前跟踪探测器的选择,使用180nm高电阻率CMOS工艺的原型已经设计和生产,目前正在评估中。使用绝缘体上硅工艺的不同设计正在对顶点探测器和跟踪探测器进行研究。所有原型都在实验室和光束测试中进行了测试,并使用新开发的模拟工具结合Geant4和TCAD来评估和优化其性能。这篇文章概述了CLIC顶点和跟踪检测器的研发计划,突出了原型的新结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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