Chipless RFID with Fully Inkjet Printed Tags: A Practical Case Study for Low Cost Smart Packaging Applications

Jarrid A. Wittkopf, Ning Ge, R. Ionescu, Wagston Staehler, Doug Pederson, H. Holder
{"title":"Chipless RFID with Fully Inkjet Printed Tags: A Practical Case Study for Low Cost Smart Packaging Applications","authors":"Jarrid A. Wittkopf, Ning Ge, R. Ionescu, Wagston Staehler, Doug Pederson, H. Holder","doi":"10.1109/ECTC.2018.00144","DOIUrl":null,"url":null,"abstract":"Chipless RFIDs are a disruptive technology that acts as a moderate solution between conventional barcodes and chipped RFIDs. These devices allow for cost savings compared to chipped RFIDs and can be identified even with an obstructed view of the tag. One category of chipless RFID is known as the radar cross section (RCS) backscattered chipless RFID. RCS Chipless RFID tags operate by physically encoding data with carefully designed resonating elements. These resonating elements are short electrically coupled resonators that backscatter an interrogating signal based on their frequency dependent RCS signature. In this study, we investigate through simulation and experimental results the properties of four inkjet printable RCS backscattered chipless RFID designs. Each of the designs have different resonating elements that effect the tags reading range, readability, tag size, bandwidth utilization, and polarization dependence. The goal of this study is to give insight into how each of these designs will function in future smart packaging applications.","PeriodicalId":6555,"journal":{"name":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","volume":"36 1","pages":"940-947"},"PeriodicalIF":0.0000,"publicationDate":"2018-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 68th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2018.00144","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Chipless RFIDs are a disruptive technology that acts as a moderate solution between conventional barcodes and chipped RFIDs. These devices allow for cost savings compared to chipped RFIDs and can be identified even with an obstructed view of the tag. One category of chipless RFID is known as the radar cross section (RCS) backscattered chipless RFID. RCS Chipless RFID tags operate by physically encoding data with carefully designed resonating elements. These resonating elements are short electrically coupled resonators that backscatter an interrogating signal based on their frequency dependent RCS signature. In this study, we investigate through simulation and experimental results the properties of four inkjet printable RCS backscattered chipless RFID designs. Each of the designs have different resonating elements that effect the tags reading range, readability, tag size, bandwidth utilization, and polarization dependence. The goal of this study is to give insight into how each of these designs will function in future smart packaging applications.
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无芯片RFID与完全喷墨印刷标签:低成本智能包装应用的实际案例研究
无芯片rfid是一种颠覆性技术,它是传统条形码和芯片rfid之间的一种适度解决方案。与芯片rfid相比,这些设备可以节省成本,甚至可以在标签受阻的情况下进行识别。一类无芯片RFID被称为雷达横截面(RCS)后向散射无芯片RFID。RCS无芯片RFID标签通过精心设计的谐振元件对数据进行物理编码来操作。这些谐振元件是短电耦合谐振器,根据其频率相关的RCS特征反向散射询问信号。在本研究中,我们通过仿真和实验结果研究了四种可喷墨打印RCS背散射无芯片RFID设计的特性。每种设计都有不同的谐振元件,影响标签的读取范围、可读性、标签大小、带宽利用率和极化依赖性。这项研究的目的是深入了解这些设计将如何在未来的智能包装应用中发挥作用。
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