Microfluidic chips fabrication from UV curable adhesives for heterogeneous integration

V. Mokkapati, O. Bethge, R. Hainberger, H. Brueckl
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引用次数: 4

Abstract

Conventional fabrication of microfluidic chips is based on silicon, glass, PDMS and various other polymeric materials (COC, polycarbonate, PMMA etc). Silicon and glass processing technologies are highly developed and the chips can be fabricated with ease. Polymeric microfluidic chips have become very common in recent years due to the demand for the cheap and disposable devices. New entrants in to the field are UV curable adhesives which are gaining recognition as promising players in microfluidics. UV curable adhesives are generally used in various applications ranging from usage in the manufacture of parts of an aircraft to sealing/packaging of microfluidic chips. Unlike any other previously discussed materials UV curable adhesives have the flexibility in alignment and bonding during fabrication process. These adhesives can be applied in between two surfaces which are to be glued and can be left like that for hours to days without bonding them as long as the glue is not exposed to UV light. In this paper we explain the detailed fabrication of microfluidic chips (100μm wide and 3μm (NOA74), 22μm (NOA 68) deep) completely made from UV curable adhesives having better chemical resistance, permeability and flexible surface treatments compared to other known polymeric materials. Firstly the patterns were etched on silicon, followed by PDMS molding and subsequently UV curable adhesives were casted and cured on structured PDMS master. After unmolding the stamps were mounted on a glass substrate and permanent bonding was achieved by further UV treatment and/or oxygen plasma treatment. The final devices were successfully tested for any leakage. These microfluidic chips will be integrated with a sensor and antenna for further biological studies. UV curable adhesives are also used for permanent/temporary sealing of microfluidic channels. These adhesives, which are still new to the fluidics branch can functionally and economically, have a greater impact on microfluidics.
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用紫外光固化胶粘剂制备异质集成微流控芯片
传统的微流控芯片制造是基于硅,玻璃,PDMS和各种其他聚合物材料(COC,聚碳酸酯,PMMA等)。硅和玻璃加工技术高度发达,芯片可以很容易地制造。近年来,由于对廉价和一次性设备的需求,聚合物微流控芯片变得非常普遍。新进入该领域的是UV固化胶粘剂,它在微流体领域被认为是有前途的参与者。UV固化胶粘剂通常用于各种应用,从飞机部件的制造到微流控芯片的密封/包装。与之前讨论的任何其他材料不同,UV固化胶粘剂在制造过程中具有对齐和粘合的灵活性。这些粘合剂可以应用在两个要粘合的表面之间,只要胶水不暴露在紫外线下,就可以这样放置几个小时到几天而不粘合它们。在本文中,我们详细说明了微流控芯片(100μm宽,3μm (NOA74), 22μm (noa68)深)完全由紫外光固化胶粘剂制成,与其他已知的聚合物材料相比,具有更好的耐化学性,渗透性和柔性表面处理。首先将图案蚀刻在硅上,然后进行PDMS成型,然后在结构化的PDMS母版上浇铸和固化UV固化粘合剂。拆模后,将印章安装在玻璃基板上,并通过进一步的紫外线处理和/或氧等离子体处理实现永久粘合。最后的装置已成功地进行了泄漏测试。这些微流控芯片将与传感器和天线集成,用于进一步的生物学研究。UV固化胶粘剂也用于微流体通道的永久/临时密封。这些胶粘剂在功能和经济上仍然是流体学分支的新事物,对微流体学有更大的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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