{"title":"Using DOE to improve COB bonbability","authors":"Wei Xin, Sherry Y. Chen, W. Chien","doi":"10.1109/CSTIC.2017.7919870","DOIUrl":null,"url":null,"abstract":"In recent years, the Chip-on-Board (COB) package technology has become popular in semiconductor industries. The COB technology, in which the dies are directly mounted onto a printed circuit board (PCB) with bonding wires connecting the die and leads. Besides solder bumps, wire bonding is still the most popular interconnect method. With the development of wire bonding technology in the COB package, we can realize advanced processes with good performance by new wire bonding equipment and more powerful software. However, there are still many challenges to be overcome in the bonding process. In this paper, we did experiments to optimize the bonding parameter using 1.0mil Au wire on COB and successfully found the optimal range of bonding parameters through DOE (Design Of Experiment). By the optimal solution, we further improved the bondability; the second bonding quality was also improved by using BSOB (Bond Stitch On Ball) bonding.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"199 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919870","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In recent years, the Chip-on-Board (COB) package technology has become popular in semiconductor industries. The COB technology, in which the dies are directly mounted onto a printed circuit board (PCB) with bonding wires connecting the die and leads. Besides solder bumps, wire bonding is still the most popular interconnect method. With the development of wire bonding technology in the COB package, we can realize advanced processes with good performance by new wire bonding equipment and more powerful software. However, there are still many challenges to be overcome in the bonding process. In this paper, we did experiments to optimize the bonding parameter using 1.0mil Au wire on COB and successfully found the optimal range of bonding parameters through DOE (Design Of Experiment). By the optimal solution, we further improved the bondability; the second bonding quality was also improved by using BSOB (Bond Stitch On Ball) bonding.
近年来，板上芯片(COB)封装技术已成为半导体行业的热门技术。COB技术，其中模具直接安装在印刷电路板(PCB)上，用键合线连接模具和引线。除了焊料凸起，线键合仍然是最流行的互连方法。随着COB封装中线接技术的发展，新的线接设备和更强大的软件可以实现性能优良的先进工艺。然而，在键合过程中仍有许多挑战需要克服。本文利用1.0mil Au线在COB上进行了键合参数优化实验，并通过DOE (Design of Experiment)找到了最佳的键合参数范围。通过最优解，进一步提高了粘结性;采用BSOB (Bond Stitch On Ball)键合也提高了二次键合质量。
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