X. Jing, Di Chen, Baozeng Zhang, Jingquan Liu, Jun Zhu
{"title":"A New Fabrication Method for 3D Multilayer Microstructure","authors":"X. Jing, Di Chen, Baozeng Zhang, Jingquan Liu, Jun Zhu","doi":"10.1109/NEMS.2006.334846","DOIUrl":null,"url":null,"abstract":"A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics between the SU-8 photoresist and the surface of etched silicon substrate was studied. Two steps that can thoroughly remove bubbles in the etched silicon groove are also employed. To demonstrate this combination of micro fabrication process, some SU-8 microstructures are successfully fabricated in the etched silicon grooves. This method has applications in multi-layer microstructure fabrication","PeriodicalId":6362,"journal":{"name":"2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"366 1","pages":"567-570"},"PeriodicalIF":0.0000,"publicationDate":"2006-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 1st IEEE International Conference on Nano/Micro Engineered and Molecular Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2006.334846","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A new method for realization of 3D multilayer micro structures is presented in this paper. It consists of two major processes: silicon etching process and UV-LIGA process. In this way, some shape limitations of single technology can be overcome for new functions. By combining these processes, multilayer structures and complex graphics can be fabricated. To make good combination, the adhesive characteristics between the SU-8 photoresist and the surface of etched silicon substrate was studied. Two steps that can thoroughly remove bubbles in the etched silicon groove are also employed. To demonstrate this combination of micro fabrication process, some SU-8 microstructures are successfully fabricated in the etched silicon grooves. This method has applications in multi-layer microstructure fabrication
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